Paper
27 July 1979 Measurement Of Crack Growth And Strain Distribution Around Crack Tip Under Elevated Temperature
Tatsuhiko Aizawa, Genki Yagawa, Yoshio Ando, Katsuhiko Sakaue, Mikio Takagi
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Proceedings Volume 0189, 13th Intl Congress on High Speed Photography and Photonics; (1979) https://doi.org/10.1117/12.957570
Event: 13th International Congress on High Speed Photography and Photonics, 1978, Tokyo, Japan
Abstract
Through the macroscopic measurement of crack growth under the elevated temperature, the crack propagation rate has been found to be in better correlation with the J contour integral value than with other candidate parameters e.g. elastic stress intensity factor, net section stress. In order that this J value may be defined under the stationary creep condition, we must be aware of a certain singular strain field around the crack tip, which has been theoretically analyzed but the existence of which is not recognized experimentally. Using the Moire topographical method and digital processing of raw Moire grids and fringe patterns, the interesting informations have been obtained regarding the strain concentration at the crack tip.
© (1979) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tatsuhiko Aizawa, Genki Yagawa, Yoshio Ando, Katsuhiko Sakaue, and Mikio Takagi "Measurement Of Crack Growth And Strain Distribution Around Crack Tip Under Elevated Temperature", Proc. SPIE 0189, 13th Intl Congress on High Speed Photography and Photonics, (27 July 1979); https://doi.org/10.1117/12.957570
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KEYWORDS
Image processing

Moire patterns

Fringe analysis

Temperature metrology

Fourier transforms

Linear filtering

Strain analysis

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