Paper
27 July 1979 Sensitive Materials For Image Instrumentation
Eiichi Mizuki
Author Affiliations +
Proceedings Volume 0189, 13th Intl Congress on High Speed Photography and Photonics; (1979) https://doi.org/10.1117/12.957544
Event: 13th International Congress on High Speed Photography and Photonics, 1978, Tokyo, Japan
Abstract
The following four materials or phenomena are described in this report. (1) In contrast to wet-developing photopolymer systems now widely used, a new dry-developable photopolymer pro-cess (peel-apart process) for production of printed circuits and printing plates are described. (2) A real-time, high-resolution laser recording dry film consisting of a transparent substrate, an evaporated thin-film, and a protective overcoat is described. (3) A photographic material consisting of a silver halide emulsion layer formed on a metal or metal oxide layer deposited on a transparent support, and processes therefor are described. (4) Certain silver halide materials intended for high intensity and short time exposure were developed, with physical measurements made on these materials being described.
© (1979) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eiichi Mizuki "Sensitive Materials For Image Instrumentation", Proc. SPIE 0189, 13th Intl Congress on High Speed Photography and Photonics, (27 July 1979); https://doi.org/10.1117/12.957544
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KEYWORDS
Silver

Image processing

Photography

Chromium

Metals

Etching

Adhesives

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