Practical Deep Ultraviolet - The Multilayer Approach

Mary L. Long

doi:10.1117/12.933412

30 June 1982 Practical Deep Ultraviolet - The Multilayer Approach

Mary L. Long

Proceedings Volume 0333, Submicron Lithography I; (1982) https://doi.org/10.1117/12.933412
Event: 1982 Microlithography Conferences, 1982, Santa Clara, United States

Abstract

Wafer imaging technology has changed significantly in the past few years, responding to the demands of LSI and VLSI circuitry. The powerful driving force of economics indicates that the LSI trend will continue with reduced line widths and greater complexity to achieve a higher level of functions in reduced area. Even with signigicant cost increases due to advanced equipment and zero defect mask or wafer fabrication, increased integration is cost effective and progression toward sub-micron design rules is expected to continue. 1 The major question is how sub-micron technology will be implemented into the production environment.

Citation Download Citation

Mary L. Long "Practical Deep Ultraviolet - The Multilayer Approach", Proc. SPIE 0333, Submicron Lithography I, (30 June 1982); https://doi.org/10.1117/12.933412

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available