Inspection In The Third Dimension: Metal Mask Inspection Problems

Joseph E. Levine; Donald A. MacKinnon

doi:10.1117/12.933678

15 October 1982 Inspection In The Third Dimension: Metal Mask Inspection Problems

Joseph E. Levine, Donald A. MacKinnon

Proceedings Volume 0342, Integrated Circuit Metrology I; (1982) https://doi.org/10.1117/12.933678
Event: 1982 Technical Symposium East, 1982, Arlington, United States

Abstract

The thermal conduction module (TCM) used in the IBM 3081 processor series incorporates a 90mm square multilayer ceramic substrate which requires thin metal masks for thick film personalization. The LSI semiconductors used on the TCM's require similar masks. These masks require accurately located features and precise cavity geometries and surface characteristics. The type of mask encountered in manufacturing is described, and the current inspection, measurement, and data handling techniques are discussed. The need for an improved inspection system is highlighted.

Citation Download Citation

Joseph E. Levine and Donald A. MacKinnon "Inspection In The Third Dimension: Metal Mask Inspection Problems", Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982); https://doi.org/10.1117/12.933678

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