Image Placement Differences Between 1:1 Projection Aligners And 10:1 Reduction Wafer Steppers

William H. Arnold III

doi:10.1117/12.935126

7 November 1983 Image Placement Differences Between 1:1 Projection Aligners And 10:1 Reduction Wafer Steppers

William H. Arnold III

Author Affiliations +

Proceedings Volume 0394, Optical Microlithography II: Technology for the 1980s; (1983) https://doi.org/10.1117/12.935126
Event: 1983 Microlithography Conferences, 1983, Santa Clara, United States

Abstract

The characteristic image placement errors of both 1:1 projection aligners and 10:1 reduction wafer steppers are studied with reference to the overlay difference between them. Analytical models have been developed in recent years which allow the user of these sophisticated aligners to mathematically identify the many components of pattern-to-pattern registration errors. Using these models and experimental data, it is shown how the mixing of the two types of exposure tool can be done successfully. For the fabrication of present generation devices, it is possible to mix steppers using global alignment capability with 1:1 projection aligners. A realistic production overlay budget is developed for 10:1 steppers, 1:1 projection aligners, and for a process which mixes the two.

Citation Download Citation

William H. Arnold III "Image Placement Differences Between 1:1 Projection Aligners And 10:1 Reduction Wafer Steppers", Proc. SPIE 0394, Optical Microlithography II: Technology for the 1980s, (7 November 1983); https://doi.org/10.1117/12.935126

Access the abstract

PROCEEDINGS
12 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

CITATIONS

Cited by 15 scholarly publications.

Explore citations on Lens.org

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Semiconducting wafers

Distortion

Photomasks

Systems modeling

Optical alignment

Data modeling

Aluminum

Show All Keywords

RELATED CONTENT

Topography and flatness induced overlay distortion correction using resist drop...
Proceedings of SPIE (May 16 2019)

Mix-and-match lithography in a manufacturing environment
Proceedings of SPIE (July 09 1992)

In Situ Resolution and Overlay Measurement on a Stepper
Proceedings of SPIE (January 02 1986)

Optimization of a mix and match fab noninteger nonconcentric...
Proceedings of SPIE (July 26 1999)

A Production Proven Technique For Machine-To-Machine Overlay Matching
Proceedings of SPIE (July 25 1989)

Overlay measurement and analysis of x ray optical lithography for...
Proceedings of SPIE (May 13 1994)

A Production Proven Technique For Machine-To-Machine Overlay Matching
Proceedings of SPIE (October 11 1989)

Subscribe to Digital Library

Receive Erratum Email Alert

Show All Keywords

Keywords/Phrases

Search In:

Publication Years