Surface Quality Requirements And Inspection Techniques For Semiconductor Slices

Detlef Reimann

doi:10.1117/12.946351

3 September 1985 Surface Quality Requirements And Inspection Techniques For Semiconductor Slices

Detlef Reimann

Proceedings Volume 0525, Measurement and Effects of Surface Defects & Quality of Polish; (1985) https://doi.org/10.1117/12.946351
Event: 1985 Los Angeles Technical Symposium, 1985, Los Angeles, United States

Abstract

Modern semiconductor device technology imposes increasing demands on the surface perfection of polished and epitaxial silicon slices. These requirements along with the need for statistical process control call for improved objective, automated and quantifiable inspection techniques. An overview is given over various imperfections of polished and epitaxial silicon slices. Current prevailant inspection techniques are discussed with emphasis on their shortcomings regarding the above mentioned requirements.

Citation Download Citation

Detlef Reimann "Surface Quality Requirements And Inspection Techniques For Semiconductor Slices", Proc. SPIE 0525, Measurement and Effects of Surface Defects & Quality of Polish, (3 September 1985); https://doi.org/10.1117/12.946351

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