Laser Holographic Inspection Of Solder Joints On Printed Circuit Board (PCB)

Hong Jing; Geng Wanzhen; Jiang Lingzhen; Xue Wei; Ma Jing; Zhao Shijie; Yang Jingfeng

doi:10.1117/12.939057

15 January 1988 Laser Holographic Inspection Of Solder Joints On Printed Circuit Board (PCB)

Hong Jing, Geng Wanzhen, Jiang Lingzhen, Xue Wei, Ma Jing, Zhao Shijie, Yang Jingfeng

Proceedings Volume 0673, Holography Applications; (1988) https://doi.org/10.1117/12.939057
Event: Holography Applications, 1986, Beijing, China

Abstract

The principle of inspecting solder joints by holographic interferometric technique is introduced. The criterion of discriminating the flaws is suggested. The results are given and testified by metallographical sectioning.

Citation Download Citation

Hong Jing, Geng Wanzhen, Jiang Lingzhen, Xue Wei, Ma Jing, Zhao Shijie, and Yang Jingfeng "Laser Holographic Inspection Of Solder Joints On Printed Circuit Board (PCB)", Proc. SPIE 0673, Holography Applications, (15 January 1988); https://doi.org/10.1117/12.939057

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