Technologies For Automated In-Process E-Beam Metrology

Israel Nadler-Niv; Uriel Halavee

doi:10.1117/12.968346

1 January 1988 Technologies For Automated In-Process E-Beam Metrology

Israel Nadler-Niv, Uriel Halavee

Proceedings Volume 0921, Integrated Circuit Metrology, Inspection, and Process Control II; (1988) https://doi.org/10.1117/12.968346
Event: Santa Clara Symposium on Microlithography, 1988, Santa Clara, CA, United States

Abstract

A new wafer metrology system, featuring high throughput, automation, and E-beam accuracy has been developed. Novel technologies were integrated into the system in order to meet the stringent requirements of in-process VLSI critical dimension control.

Citation Download Citation

Israel Nadler-Niv and Uriel Halavee "Technologies For Automated In-Process E-Beam Metrology", Proc. SPIE 0921, Integrated Circuit Metrology, Inspection, and Process Control II, (1 January 1988); https://doi.org/10.1117/12.968346

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available