The method of optimizing mask parameter suitable for lithography process

Jianfang He; Lisong Dong; Libin Zhang; Lijun Zhao; Yayi Wei; Tianchun Ye

doi:10.1117/12.2296861

20 March 2018 The method of optimizing mask parameter suitable for lithography process

Jianfang He, Lisong Dong, Libin Zhang, Lijun Zhao, Yayi Wei, Tianchun Ye

Proceedings Volume 10587, Optical Microlithography XXXI; 1058719 (2018) https://doi.org/10.1117/12.2296861
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

In the mask manufacturing process, the thickness and sidewall angle of mask are usually determined under the condition of vertical incidence. In fact, the incident angle of light on the mask plane is oblique, especially for the freeform source in source mask optimization (SMO). At this time, the thickness and sidewall angle of mask given by previous methods will not be optimal. This paper presents a method of optimizing mask parameters, which makes the transmittance and phase shift are more optimal for lithography process. In this paper, the influence of variations on mask parameters on lithography process is evaluated by the process window. And the process window corresponding to the optimal mask structure given by our method is larger than that of the original mask structure. The conclusion that the previous mask parameters are not the optimal for lithography process is demonstrated by the simulation results.

Citation Download Citation

Jianfang He, Lisong Dong, Libin Zhang, Lijun Zhao, Yayi Wei, and Tianchun Ye "The method of optimizing mask parameter suitable for lithography process", Proc. SPIE 10587, Optical Microlithography XXXI, 1058719 (20 March 2018); https://doi.org/10.1117/12.2296861

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