High temperature baking process study in advanced mask cleaning

Dejian Li; Fen Xue; Cong Lu; Wenjun Ling; Xuefei Qin; Jie Wang

doi:10.1117/12.2536622

26 September 2019 High temperature baking process study in advanced mask cleaning

Dejian Li, Fen Xue, Cong Lu, Wenjun Ling, Xuefei Qin, Jie Wang

Proceedings Volume 11148, Photomask Technology 2019; 1114816 (2019) https://doi.org/10.1117/12.2536622
Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States

Abstract

High temperature baking treatment is a method to remove chemical residue on mask before shipping to wafer fab. When developing advanced mask technology, we need to make sure the bake treatment have no side-effect to mask quality. In this investigation, some test has been devised to study the relation between baking process and mask registration, CD movement, repaired point, ion residue and cleaning performance. We also studied how to setup a stable and efficient bake process to make the mask making flow reasonable. The high temperature bake processes was tuned by different temperature, treatment loops setting and was put at different process position to verify the performance. In this paper, OMOG and EAPSM masks were chosen to test by different process condition.

Citation Download Citation

Dejian Li, Fen Xue, Cong Lu, Wenjun Ling, Xuefei Qin, and Jie Wang "High temperature baking process study in advanced mask cleaning", Proc. SPIE 11148, Photomask Technology 2019, 1114816 (26 September 2019); https://doi.org/10.1117/12.2536622

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