Presentation + Paper
26 September 2019 Large dies stitching: a technical and cross-functional teams challenge
Author Affiliations +
Abstract
This paper addresses large dies stitching challenges. Stitching is a way to combine several shots "stitched together" to create a die larger than what can fit on a photomask. This technique that was originally dedicated to advanced research is now more widely used and requires a fully automated industrial flow. Technical constraints come from a number of different actors and results must be shared by even more teams. We will present the methodology used to optimize both the yield and the data exchange between cross-functional teams. We will show how this automated flow can be easily customized to save more silicon thanks to advanced dicing techniques.
Conference Presentation
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Philippe Morey-Chaisemartin, Eric Beisser, Frederic Brault, and Farid Benzakour "Large dies stitching: a technical and cross-functional teams challenge", Proc. SPIE 11148, Photomask Technology 2019, 111481A (26 September 2019); https://doi.org/10.1117/12.2536739
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KEYWORDS
Photomasks

Semiconducting wafers

Metrology

Databases

Lithography

Image processing

Packaging

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