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9 March 2020 Transfer printing automation for heterogeneous 3D photonic integration (Conference Presentation)
Weidong Zhou
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Proceedings Volume 11286, Optical Interconnects XX; 1128618 (2020) https://doi.org/10.1117/12.2549086
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
Heterogeneous integration of dissimilar materials are essential in achieving advanced functionalities in integrated photonics and electronics integrated chips. Over the years, transfer printing technique has emerged to be a viable and practical process for heterogeneous integration of functional nanomembranes of different crystalline semiconductor materials. Here we report the development of transfer printing automation tools and processes based on commercial Ficontec optical characterization and assemble tool. Custom-made polydimethylsiloxane (PDMS) stamp printing head was developed along with the automatic pick and printing processes. A wide range of materials were also investigated including thin film silicon and monolayer 2D materials. Improved yield and device performance were achieved based on the characterizations of optical and light-matter interactions.
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Weidong Zhou "Transfer printing automation for heterogeneous 3D photonic integration (Conference Presentation)", Proc. SPIE 11286, Optical Interconnects XX, 1128618 (9 March 2020); https://doi.org/10.1117/12.2549086
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KEYWORDS
Printing
3D printing
Crystals
Electronics
Head
Integrated photonics
Integration
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