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28 September 2021 Study of high throughput EUV mask pattern inspection technologies using multi e-beam optics
Tadayuki Sugimori, Riki Ogawa, Hidekazu Takekoshi, John G. Hartley, David J. Pinkney, Atsushi Ando, Koichi Ishii, Chosaku Noda, Nobutaka Kikuiri
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Proceedings Volume 11855, Photomask Technology 2021; 118550C (2021) https://doi.org/10.1117/12.2600987
Event: SPIE Photomask Technology + EUV Lithography, 2021, Online Only
Abstract
TN5nm HVM where EUVL was implemented on started in the middle of 2020, but EUV mask pattern inspection is still not ready in terms of fully satisfying customers' requirements. There are three tool candidates; optical, actinic, and e-beam inspection. The E-beam tools have high resolution and sensitivity, but have a low throughput. To better address market requirements, NuFlare has optimized its multi e-beam optics to inspect EUV masks, and apply D2DB method into the e-beam tool to achieve the throughput target. We describe the latest results of verification about main technologies to achieve throughput required for EUV mask inspection.
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Tadayuki Sugimori, Riki Ogawa, Hidekazu Takekoshi, John G. Hartley, David J. Pinkney, Atsushi Ando, Koichi Ishii, Chosaku Noda, and Nobutaka Kikuiri "Study of high throughput EUV mask pattern inspection technologies using multi e-beam optics", Proc. SPIE 11855, Photomask Technology 2021, 118550C (28 September 2021); https://doi.org/10.1117/12.2600987
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KEYWORDS
Inspection
Extreme ultraviolet
Photomasks
Optical inspection
EUV optics
Optics manufacturing
Deep ultraviolet
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