Spectral analysis overlay measurement approach for improvement of overlay accuracy in advanced integrated circuits

Vladimir Levinski; Yuri Paskover; Sharon Aharon; Daria Negri; Nadav Gutman; K. Nireekshan Reddy; Jeongpyo Lee; Hedvi Spielberg; Dongyoung Lee; Hyunjun Kim; Sukwon Park; Bohye Kim; Hongseok Jang; Honggoo Lee; Sangho Lee

doi:10.1117/12.2613981

26 May 2022 Spectral analysis overlay measurement approach for improvement of overlay accuracy in advanced integrated circuits

Vladimir Levinski, Yuri Paskover, Sharon Aharon, Daria Negri, Nadav Gutman, K. Nireekshan Reddy, Jeongpyo Lee, Hedvi Spielberg, Dongyoung Lee, Hyunjun Kim, Sukwon Park, Bohye Kim, Hongseok Jang, Honggoo Lee, Sangho Lee

Author Affiliations +

Proceedings Volume 12053, Metrology, Inspection, and Process Control XXXVI; 120531Z (2022) https://doi.org/10.1117/12.2613981
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States

Conference Poster

Abstract

Overlay metrology plays a significant role in process and yield control for integrated circuit (IC) manufacturing. As the On-Product Overlay (OPO) in advance nodes is reduced to a few nanometers, a very small margin is left for measurement inaccuracy. We introduce a multi-wavelength (spectral) analysis and measurement method, capable of characterizing overlay inaccuracy signatures on the wafer, and quantifying and removing the inaccuracy portion of the overlay measurement, resulting in a more accurate measurement, better process control, and yield enhancement. This method was applied to SK hynix’s advanced process production wafers, demonstrating an enhancement in accuracy over single-wavelength based overlay measurements.

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Vladimir Levinski, Yuri Paskover, Sharon Aharon, Daria Negri, Nadav Gutman, K. Nireekshan Reddy, Jeongpyo Lee, Hedvi Spielberg, Dongyoung Lee, Hyunjun Kim, Sukwon Park, Bohye Kim, Hongseok Jang, Honggoo Lee, and Sangho Lee "Spectral analysis overlay measurement approach for improvement of overlay accuracy in advanced integrated circuits", Proc. SPIE 12053, Metrology, Inspection, and Process Control XXXVI, 120531Z (26 May 2022); https://doi.org/10.1117/12.2613981

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