A co-packaged photoelectric converter module

Xiaomeng Lyu; Ao Liao; Yilong Wu; Weihua Xu; Fei Jing; Bingxu Zhao; Xibin Li; Zhen Yang

doi:10.1117/12.2616459

15 February 2022 A co-packaged photoelectric converter module

Xiaomeng Lyu, Ao Liao, Yilong Wu, Weihua Xu, Fei Jing, Bingxu Zhao, Xibin Li, Zhen Yang

Proceedings Volume 12166, Seventh Asia Pacific Conference on Optics Manufacture and 2021 International Forum of Young Scientists on Advanced Optical Manufacturing (APCOM and YSAOM 2021); 121663J (2022) https://doi.org/10.1117/12.2616459
Event: Seventh Asia Pacific Conference on Optics Manufacture and 2021 International Forum of Young Scientists on Advanced Optical Manufacturing (APCOM and YSAOM 2021), 2021, Hong Kong, Hong Kong

Abstract

Microwave photonics technology (MWP), which has been applied to various radar, Telcom, Electronic Warfare systems, is now facing more and more challenging development trend of miniaturization and modular array for increasing node counts and system complexity. The hybrid-integration microassembly process, which could effectively realize the integrated system of photonic devices, microwave devices and electrical circuits, are utilized to achieve small volume and simple preparation technology for rapid engineering and miniaturization. In this paper, we introduced an ultra-compact photoelectric converter array module fabricated with hybrid-integration microassembly process, the practical test results showed a good optical coupling and S-parameters over a wide frequency range. Furthermore, this could be easily expanded for multi-channels MWP application scenarios.

Citation Download Citation

Xiaomeng Lyu, Ao Liao, Yilong Wu, Weihua Xu, Fei Jing, Bingxu Zhao, Xibin Li, and Zhen Yang "A co-packaged photoelectric converter module", Proc. SPIE 12166, Seventh Asia Pacific Conference on Optics Manufacture and 2021 International Forum of Young Scientists on Advanced Optical Manufacturing (APCOM and YSAOM 2021), 121663J (15 February 2022); https://doi.org/10.1117/12.2616459

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