Temperature-controlled dual-wavelength digital holographic microscope system to measure chip package morphology

Jianjiang Xu; Yi Liu

doi:10.1117/12.2644321

9 September 2022 Temperature-controlled dual-wavelength digital holographic microscope system to measure chip package morphology

Jianjiang Xu, Yi Liu

Author Affiliations +

Proceedings Volume 12328, Second International Conference on Optics and Image Processing (ICOIP 2022); 123280T (2022) https://doi.org/10.1117/12.2644321
Event: Second International Conference on Optics and Image Processing (ICOIP 2022), 2022, Taian, China

Abstract

Measuring the surface topography of the chip package can detect the quality of chip package. Aiming at the problem of the high aspect ratio of the chip package topography, this paper proposes a dual-wavelength digital holographic microscope measurement system based on temperature-controlled modulation of the laser wavelength. The system uses two identical lasers, and the temperature-controlled modulation of one of the lasers has a wavelength shift interval of 2.81 nm, and the difference between the two-wavelength lasers is 2.30 nm. Building a dual-wavelength digital microscope holography system to record the surface topography hologram of the 24μm standard specimen and the chip package specimen, experimental results verify the system’s performance.

Citation Download Citation

Jianjiang Xu and Yi Liu "Temperature-controlled dual-wavelength digital holographic microscope system to measure chip package morphology", Proc. SPIE 12328, Second International Conference on Optics and Image Processing (ICOIP 2022), 123280T (9 September 2022); https://doi.org/10.1117/12.2644321

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