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We released a novel Near-Packaged Optics (NPO) module for short reach interconnect using silicon photonics devices. The module has high-speed signal lanes up to 32 Gbps x 16 lanes with PCIe Gen 5 support. It also has a very small module size of 13 cm2 and a low power consumption of about 9 W. In addition, the module is compliance with Telcordia-GR-468-CORE. The electrical and optical interfaces are a board-to-board mezzanine connector and a multi-mode fiber array, respectively. By using multi-mode fibers, we were able to achieve error-free transmission up to 30 m and reduce mounting costs by passive alignment.
Tomoyuki Akahoshi,Takashi Yamamoto,Saki Tsujino,Misa Takahashi, andTakahiro Matsubara
"Near-packaged optics module with 32Gbps x 16 lanes for short reach interconnect", Proc. SPIE 12429, Next-Generation Optical Communication: Components, Sub-Systems, and Systems XII, 1242915 (15 March 2023); https://doi.org/10.1117/12.2653218
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Tomoyuki Akahoshi, Takashi Yamamoto, Saki Tsujino, Misa Takahashi, Takahiro Matsubara, "Near-packaged optics module with 32Gbps x 16 lanes for short reach interconnect," Proc. SPIE 12429, Next-Generation Optical Communication: Components, Sub-Systems, and Systems XII, 1242915 (15 March 2023); https://doi.org/10.1117/12.2653218