Open Access Paper
22 June 2023 Front Matter: Volume 12536
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 12536, including the Title Page, Copyright information, and Conference Committee lists.

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

The papers reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from these proceedings:

Author(s), “Title of Paper,” in Thermosense: Thermal Infrared Applications XLV, edited by Nicolas P. Avdelidis, Proc. of SPIE 12536, Seven-digit Article CID Number (DD/MM/YYYY); (DOI URL).

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510661868

ISBN: 9781510661875 (electronic)

Published by

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Copyright © 2023 Society of Photo-Optical Instrumentation Engineers (SPIE).

Copying of material in this book for internal or personal use, or for the internal or personal use of specific clients, beyond the fair use provisions granted by the U.S. Copyright Law is authorized by SPIE subject to payment of fees. To obtain permission to use and share articles in this volume, visit Copyright Clearance Center at copyright.com. Other copying for republication, resale, advertising or promotion, or any form of systematic or multiple reproduction of any material in this book is prohibited except with permission in writing from the publisher.

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Publication of record for individual papers is online in the SPIE Digital Library.

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Paper Numbering: A unique citation identifier (CID) number is assigned to each article in the Proceedings of SPIE at the time of publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online and print versions of the publication. SPIE uses a seven-digit CID article numbering system structured as follows:

  • The first five digits correspond to the SPIE volume number.

  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Conference Committee

Symposium Chairs

  • Tien Pham, The MITRE Corporation (United States)

  • Douglas R. Droege, L3Harris Technologies, Inc. (United States)

Symposium Co-chairs

  • Augustus W. Fountain III, University of South Carolina (United States)

  • Teresa L. Pace, L3Harris Technologies, Inc. (United States)

Program Track Chair

  • Ann Marie Raynal, Sandia National Laboratories (United States)

Conference Chair

  • Nicolas P. Avdelidis, Cranfield University (United Kingdom)

Conference Co-chairs

  • Fernando López, TORNGATS (Canada)

  • Arantza Mendioroz, Universidad del País Vasco (Spain)

Conference Program Committee

  • Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

  • Michael C. Borish, Oak Ridge National Laboratory (United States)

  • Douglas Burleigh, La Jolla Cove Consulting (United States)

  • L. Terry Clausing, Drysdale and Associates, Inc. (United States)

  • Fred P. Colbert, Colbert Infrared Services, Inc. (United States)

  • Jaap de Vries, FM Global (United States)

  • Giovanni Ferrarini, Istituto per le Tecnologie della Costruzione (Italy)

  • Sheng-Jen Hsieh, Texas A&M University (United States)

  • Timo T. Kauppinen, Arctic Construction Cluster Finland (Finland)

  • Dennis H. LeMieux, Siemens Power Generation, Inc. (United States)

  • Monica Lopez Saenz, IRCAM GmbH (Germany)

  • Xavier P. V. Maldague II, Université Laval (Canada)

  • Junko Morikawa, Tokyo Institute of Technology (Japan)

  • Gary L. Orlove, Teledyne FLIR LLC (United States)

  • Beate Oswald-Tranta, Montan University Leoben (Austria)

  • G. Raymond Peacock, Temperatures.com, Inc. (United States)

  • Ralph A. Rotolante, Vicon Infrared (United States)

  • Andrés Esteban Rozlosnik, SI Termografía Infrarroja (Argentina)

  • Morteza Safai, The Boeing Company (United States)

  • Takahide Sakagami, Kobe University (Japan)

  • Steven M. Shepard, Thermal Wave Imaging, Inc. (United States)

  • Sami Siikanen, VTT Technical Research Center of Finland Ltd. (Finland)

  • Peter Spaeth, NASA (United States)

  • Gregory R. Stockton, Stockton Infrared Thermographic Services, Inc. (United States)

  • Gary E. Strahan, Infrared Cameras, Inc. (United States)

  • Vladimir P. Vavilov, National Research Tomsk Polytechnic University (Russian Federation)

  • Catherine R. Ward, General Atomics Aeronautical Systems, Inc. (United States)

  • Vili Joseph N. Zalameda, NASA Langley Research Center (United States)

© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 12536", Proc. SPIE 12536, Thermosense: Thermal Infrared Applications XLV, 1253601 (22 June 2023); https://doi.org/10.1117/12.2689935
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KEYWORDS
Thermography

Infrared cameras

Infrared radiation

3D image processing

Infrared sensors

Inspection

Nondestructive evaluation

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