Paper
27 June 2023 Research on PCB solder joint defect detection method based on machine vision
Yuanpei Chang, Ying Xue, Yu Zhang, Jiajun Ma, Guangjie Li, Dandan Wu, Qiang Zhan, Jiancun Zuo
Author Affiliations +
Proceedings Volume 12705, Fourteenth International Conference on Graphics and Image Processing (ICGIP 2022); 127050M (2023) https://doi.org/10.1117/12.2680409
Event: Fourteenth International Conference on Graphics and Image Processing (ICGIP 2022), 2022, Nanjing, China
Abstract
Printed circuit boards (PCBs) are an essential component of electronic products, and detecting solder joint defects is critical in the PCB production process. Machine vision technology allows detection with high efficiency and cost-effectiveness. Therefore, this paper summarizes the basic principles of image processing-based and machine learning-based methods for defect detection and compares the advantages and disadvantages of both methods with relevant performance evaluation indicators. Finally, this paper contains a summary and an outlook.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yuanpei Chang, Ying Xue, Yu Zhang, Jiajun Ma, Guangjie Li, Dandan Wu, Qiang Zhan, and Jiancun Zuo "Research on PCB solder joint defect detection method based on machine vision", Proc. SPIE 12705, Fourteenth International Conference on Graphics and Image Processing (ICGIP 2022), 127050M (27 June 2023); https://doi.org/10.1117/12.2680409
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KEYWORDS
Defect detection

Image processing

Image segmentation

Feature extraction

Detection and tracking algorithms

Machine learning

Deep learning

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