Abstract
“This PDF file contains the front matter associated with SPIE Proceedings Volume 12783, including the Title Page, Copyright information, Table of Contents, Committee Page and Introduction.

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

The papers reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from these proceedings: Author(s), “Title of Paper,” in International Conference on Images, Signals, and Computing (ICISC 2023), edited by Qian He, Ioannis Kypraios, Lipo Wang, Proc. of SPIE 12783, Seven-digit Article CID Number (DD/MM/YYYY); (DOI URL).

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510668164

ISBN: 9781510668171 (electronic)

Published by

SPIE

P.O. Box 10, Bellingham, Washington 98227-0010 USA

Telephone +1 360 676 3290 (Pacific Time)

SPIE.org

Copyright © 2023 Society of Photo-Optical Instrumentation Engineers (SPIE).

Copying of material in this book for internal or personal use, or for the internal or personal use of specific clients, beyond the fair use provisions granted by the U.S. Copyright Law is authorized by SPIE subject to payment of fees. To obtain permission to use and share articles in this volume, visit Copyright Clearance Center at copyright.com. Other copying for republication, resale, advertising or promotion, or any form of systematic or multiple reproduction of any material in this book is prohibited except with permission in writing from the publisher.

Printed in the United States of America by Curran Associates, Inc., under license from SPIE.

Publication of record for individual papers is online in the SPIE Digital Library.

00006_PSISDG12783_1278301_page_2_1.jpg

Paper Numbering: A unique citation identifier (CID) number is assigned to each article in the Proceedings of SPIE at the time of publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online and print versions of the publication. SPIE uses a seven-digit CID article numbering system structured as follows:

  • The first five digits correspond to the SPIE volume number.

  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Conference Committee

General Chairs

  • Kelum Gamage, The University of Glasgow (United Kingdom)

  • Qian He, University of Electronic Science and Technology of China (China)

  • Ioannis Kypraios, De Montfort University (United Kingdom)

  • Lipo Wang, Nanyang Technological University (Singapore)

  • Haiquan Zhao, Southwest Jiaotong University (China)

Publicity Chairs

  • Yong Fang, Chang’an University (China)

  • Tian Lan, University of Electronic Science and Technology of China (China)

  • Jin Li, Shaanxi Normal University (China)

  • Yun Liu, Southwest University (China)

  • Xin Lu, De Montfort University (United Kingdom)

Publication Chairs

  • Mohamed Khaled Almekkawy, Pennsylvania State University (United States)

  • Qiang Li, Shenzhen University (China)

  • Edward Wong, New York University (United States)

Program Chairs

  • Xiaohua (Edward) Li, Binghamton University (United States)

  • Jin Liu, Central South University (China)

Committee Members

  • Sathyanarayanan Aakur, Oklahoma State University–Stillwater (United States)

  • Mohamed Khaled Almekkawy, Pennsylvania State University (United States)

  • Bo Cai, Southwest University of Science and Technology (China)

  • Fei Cai, Hunan Normal University (China)

  • Aibin Chen, Central South University of Forestry and Technology (China)

  • Changsheng Chen, Shenzhen University (China)

  • Guangzhu Chen, Chengdu University of Technology (China)

  • Honghong Chen, Xihua University (China)

  • Jing Chen, Chongqing University (China)

  • Peng Chen, Xihua University (China)

  • Yanping Chen, Guizhou University (China)

  • Ji-Xin Cheng, Boston University (United States)

  • Shi Cheng, Shaanxi Normal University (China)

  • Chun-hua Chu, Hainan University (China)

  • Raffaele de Amicis, Oregon State University (United States)

  • Yong Fang, Chang’an University (China)

  • Kelum Gamage, The University of Glasgow (United Kingdom)

  • Yan Gan, Chongqing University (China)

  • Lianli Gao, University of Electronic Science and Technology of China (China)

  • Shengwen Guo, South China University of Technology (China)

  • Zhiwei Guo, Chongqing Technology and Business University (China)

  • Abolfazl Hashemi, Purdue University (United States)

  • Hongsen He, Southwest University of Science and Technology (China)

  • Qian He, University of Electronic Science and Technology of China (China)

  • Xing He, Shantou University (China)

  • Feifei Hou, Central South University (China)

  • Nan Hu, Soochow University (China)

  • Xiao Hu, Emory University (United States)

  • Xin Hu, Chang’an University (China)

  • He Huang, Soochow University (China)

  • Luwen Huang, Northwest A&F University (China)

  • Renjie Huang, Southwest University (China)

  • Ke Jia, Chengdu University of Information Technology (China)

  • Junzheng Jiang, Guilin University of Electronic Technology (China)

  • Wenbo Jiang, Xihua University (China)

  • Tao Ju, Lanzhou Jiaotong University (China)

  • Ioannis Kypraios, De Montfort University (United Kingdom)

  • Tian Lan, University of Electronic Science and Technology of China (China)

  • Fan Li, Xi’an Jiaotong University (China)

  • Jin Li, Shaanxi Normal University (China)

  • Qiang Li, Shenzhen University (China)

  • Wanchun Li, University of Electronic Science and Technology of China (China)

  • Xiaohua (Edward) Li, Binghamton University (United States)

  • Xiaolong Li, University of Electronic Science and Technology of China (China)

  • Xiuhua Li, Chongqing University (China)

  • Zhongyu Li, University of Electronic Science and Technology of China (China)

  • Xiao Liang, Southwest Petroleum University (China)

  • Dongmei Lin, Lanzhou University of Technology (China)

  • Chuanlin Liu, Southwest Petroleum University (China)

  • Hanqiang Liu, Shaanxi Normal University (China)

  • Jin Liu, Central South University (China)

  • Jinping Liu, Hunan Normal University (China)

  • Ruihua Liu, Chongqing University of Technology (China)

  • Shuai Liu, Hunan Normal University (China)

  • Yun Liu, Southwest University (China)

  • Zhanwen Liu, Chang’an University (China)

  • Shenglian Lu, Guangxi Normal University (China)

  • Xin Lu, De Montfort University (United Kingdom)

  • Zhihua Lu, Ningbo University (China)

  • Renze Luo, Southwest Petroleum University (China)

  • Miao Ma, Shaanxi Normal University (China)

  • Fan Min, Southwest Petroleum University (China)

  • Chad Mourning, Ohio University (United States)

  • Dong Pan, Central South University (China)

  • Bo Peng, Southwest Petroleum University (China)

  • Hong Peng, Xihua University (China)

  • Jun Peng, Chongqing University of Science and Technology (China)

  • Qihang Peng, University of Electronic Science and Technology of China (China)

  • Xiaoming Peng, University of Electronic Science and Technology of China (China)

  • Michael Pusateri, Pennsylvania State University (United States)

  • Bin Qin, Hunan University of Technology (China)

  • Chao Ren, Sichuan University (China)

  • Hisham Sager, Colorado School of Mines (United States)

  • Aarti Sathyanarayana, Northeastern University (United States)

  • Yanhua Shao, Southwest University of Science and Technology (China)

  • Wenjing Shen, Shenzhen Technology University (China)

  • Yongpan Sheng, Chongqing University (China)

  • Chuang Shi, University of Electronic Science and Technology of China (China)

  • Lingyun Song, Northwestern Polytechnical University (China)

  • Yimao Sun, Sichuan University (China)

  • Zhi Sun, University of Electronic Science and Technology of China (China)

  • Yujuan Tan, Chongqing University (China)

  • Xiaochuan Tang, Chengdu University of Technology (China)

  • Guoqing Wang, University of Electronic Science and Technology of China (China)

  • Hongxing Wang, Chongqing University (China)

  • Tao Wang, Northwestern Polytechnical University (China)

  • Wenyong Wang, University of Electronic Science and Technology of China (China)

  • Yongtian Wang, Northwestern Polytechnical University (China)

  • Zhengning Wang, University of Electronic Science and Technology of China (China)

  • Zhuoran Wang, University of Electronic Science and Technology of China (China)

  • Edward Wong, New York University (United States)

  • Jie Wu, Shaanxi Normal University (China)

  • Junyun Wu, Nanchang University (China)

  • Lianwei Wu, Northwestern Polytechnical University (China)

  • Yifeng Wu, Sun Yat-sen University (China)

  • Juanying Xie, Shaanxi Normal University (China)

  • Weicheng Xie, Xihua University (China)

  • Feng Xu, Southwest University of Science and Technology (China)

  • Jian Xu, Louisiana State University (United States)

  • Liming Xu, China West Normal University (China)

  • Zhigang Xu, Lanzhou University of Technology (China)

  • Guiqin Yang, Lanzhou Jiaotong University (China)

  • Xiaojun Yang, Chang’an University (China)

  • Xin Yang, Southwestern University of Finance and Economics (China)

  • Mang Ye, Wuhan University (China)

  • Yi Yu, Southwest University of Science and Technology (China)

  • Jianjun Yuan, Southwest University (China)

  • Yongna Yuan, Lanzhou University (China)

  • Liaoyuan Zeng, University of Electronic Science and Technology of China (China)

  • Erlei Zhang, Northwest A&F University (China)

  • Haixi Zhang, Northwest A&F University (China)

  • Le Zhang, University of Electronic Science and Technology of China (China)

  • Lizong Zhang, University of Electronic Science and Technology of China (China)

  • Ting Zhang, Zhejiang University (China)

  • Xiaoqiang Zhang, Southwest University of Science and Technology (China)

  • Xiaozhi Zhang, University of South China (China)

  • Xingpeng Zhang, Southwest Petroleum University (China)

  • Haiquan Zhao, Southwest Jiaotong University (China)

  • Yu Zhao, Southwestern University of Finance and Economics (China)

  • Xiaojun Zhou, Central South University (China)

  • Donglan Zou, Xinyu University (China)

Introduction

On behalf of the organizing committee, it is my honor and pleasure to welcome all of you to the 2023 International Conference on Images, Signals, and Computing (ICISC 2023).

ICISC 2023 aims to bring together researchers and scientists from academia, industry, and government laboratories to present new results and identify future research directions in images, signals, and computing. Recent research in these fast has witnessed significant progress. Innovations in image recognition have propelled computer vision applications, enabling accurate object detection and analysis. Signal processing advancements have enhanced data transmission, leading to improved telecommunications and faster information exchange. Moreover, computing capabilities have surged, enabling more powerful and efficient algorithms for artificial intelligence and machine learning. These advancements have revolutionized various domains, including healthcare, robotics, and autonomous systems, paving the way for transformative technologies and applications with widespread impact on society. We are delighted to receive a number of submissions from around the globe. After a rigorous review process, the accepted papers are included in the conference program and proceedings.

During this conference, we will have the opportunity to engage in stimulating discussions, attend insightful keynote speeches, and witness the presentation of exciting research papers. ICISC 2023 will provide a platform to explore emerging trends, share best practices, and envision the future of images, signals, and computing.

As we delve into the conference sessions, let us embrace the spirit of collaboration and foster an environment of open dialogue. Let us engage in fruitful debates, challenge conventional wisdom, and inspire each other to push the boundaries of what is possible.

We would like to sincerely thank all organizing committee members, program committee members, and reviewers for their hard work and valuable contribution. Without your help, this conference would not have been possible. Special thanks go to SPIE for publishing the proceedings. We are very grateful to the keynote speakers for their authoritative speeches. We thank all authors and conference participants for using this platform to communicate your excellent work. I warmly invite all of you to participate in the next year’s ICISC 2024.

Once again, I extend a warm welcome to all of you. May this conference be a catalyst for groundbreaking discoveries, foster collaboration, and ignite a passion for further advancements in images, signals, and computing.

Thank you, and let us embark on this remarkable journey together!

Qian He

© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 12783", Proc. SPIE 12783, International Conference on Images, Signals, and Computing (ICISC 2023), 1278301 (21 August 2023); https://doi.org/10.1117/12.3004480
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Lithium

Data modeling

Image segmentation

Lutetium

Machine learning

Signal detection

Detection and tracking algorithms

Back to Top