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Conference CommitteeConference Chairs Uwe Behringer, UBC Microelectronics (Germany) Jo Finders, ASML Netherlands B.V. (Netherlands)
Conference Co-chairs Brid Connolly, Toppan Photomasks GmbH (Germany) Chris Gale, Applied Materials GmbH (Germany) Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)
Program Chairs Ines Stolberg, Vistec Electron Beam GmbH (Germany) Andreas Erdmann, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany) Hans Loeschner, IMS Nanofabrication (Austria)
Program Co-chairs Jan Hendrik Peters, bmbg Consult (Germany) Daniel Sarlette, Infineon Technologies Dresden GmbH (Germany)
Additional Program Committee Members Frank E. Abboud, Intel Corporation (United States) René Born, Photronics, Inc. (United States) Albrecht Ehrmann, Carl Zeiss SMT GmbH (Germany) Dave Farar, HOYA (United Kingdom) Reinhard Galler, EQUIcon Software GmbH Jena (Germany) Bertrand Le Gratiet, STMicroelectronics S.A. (France) Harry J. Levinson, HJL Lithography (United States) Michael Muehlberger, PROFACTOR GmbH (Austria) Nico Noack, Advanced Mask Technology Center GmbH Company KG (Germany) Laurent Pain, CEA-LETI (France) Kurt Ronse, imec (Belgium) Serap Savari, Texas A&M University (United States) Thomas Franz Karl Scheruebl, Carl Zeiss SMS Ltd. (Germany) Ronald Schnabel, VDE/VDI-GMM (Germany) Steffen Schulze, SIEMENS (United States) Rolf Seltmann, Carl Zeiss SMT GmbH (Germany) Yoshitake Shushuke, NuFlare Technology (Japan) Frank Sundermann, STMicroelectronics (France) Raluca Tiron, CEA-LETI (France) Martin Tschinkl, Toppan Photomasks GmbH (Germany) Jacques Waelpoel, ASML Netherlands B.V. (Netherlands) Stefan Wurm, ATICE LLC (United States) Larry Zurbrick, Keysight Technologies (United States)
Session Chairs 1 Tutorial on EUV Lithography Albrecht Ehrmann, Carl Zeiss SMT GmbH (Germany) Hans Loeschner, IMS Nanofabrication (Austria) 2 Student Presentations Andreas Erdmann, Fraunhofer IISB (Germany) Laurent Pain, CEA-LETI (France) 3 1st Plenary Ines Stolberg, Visted Electron Beam (Germany) Stefan Wurm, ATICE LLC (United States) 4 DUV and EUV Lithography Jo Finders, ASML (Netherlands) Albrecht Ehrmann, Carl Zeiss SMT GmbH (Germany) 5 Mask Patterning and Processing Frank E. Abboud, INTEL (United States) Martin Tschinkl, Toppan Photomasks (Germany) 6 Mask and Resist Optimization Kurt Ronse, IMEC (Belgium) Andreas Erdmann, Fraunhofer IISB (Germany) 7 Poster Session René Born, Photronics MZB (Germany) Uwe Behringer, UBC Microelectronics (Germany) 8 2nd Plenary Naoy Hayashi, DNP (Japan) Daniel Sarlette, INFINEON (Germany) 9 Maskless Lithography and Metrology Jan Hendrik Peters, bmbg Consult (Germany) Rolf Seltmann, RS litho consult (Germany) 10 Mask Metrology, Tuning and Inspection Thomas Franz Karl Scheruebl, Carl Zeiss SMT (Germany) Nico Noack, AMTC (Germany) 11 Nano-Imprint Lithography (NIL) Rolf Seltmann, RS litho consult (Germany) Michael Muehlberger, Profactor (Austria) 12 Data Analytics Bertrand Le Gratiet, STMicroelectronics (France) Reinhard Galler, EQUIcon (Germany)
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