Laser induced forward transfer with high resolution for microelectronics applications

Ali Gökhan Demir; Dario Crimella; Christian Piovera

doi:10.1117/12.3001784

12 March 2024 Laser induced forward transfer with high resolution for microelectronics applications

Ali Gökhan Demir, Dario Crimella, Christian Piovera

Proceedings Volume 12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX; 128720A (2024) https://doi.org/10.1117/12.3001784
Event: SPIE LASE, 2024, San Francisco, California, United States

Abstract

Pulsed lasers can be used to eject materials from transparent donors through an ablation-based expulsion mechanism. Laser Induced Forward Transfer (LIFT) is an approach based on expelling material from a donor towards a receiver. The method can be potentially exploited to develop multi-material deposition systems for producing freestanding products as well as hybrid manufacturing combined with other processes for microelectronics applications. The size of the ejected material depends on temporal and spatial interaction of the laser beam as well as the size of the donor material. The combined use of femtosecond pulses, UV wavelength, and nm-sized solid donors can allow to reduce the droplet size towards nm scale. Hence, this work shows the development of the system architecture and the process for the laser induced forward transfer of PVD produced pure titanium. The relationship between the laser related parameters, the formation of the droplets and different regimes were defined. Single droplets with sub-micrometer diameters and heights in nanometer range were successfully produced. The results are then used for developing a platform for 3D material deposition from nano to microscale dimensions to be used in microelectronic applications.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Ali Gökhan Demir, Dario Crimella, and Christian Piovera "Laser induced forward transfer with high resolution for microelectronics applications", Proc. SPIE 12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX, 128720A (12 March 2024); https://doi.org/10.1117/12.3001784

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