Direct optical wiring (DOW)-based optical interconnects for optical communications using LD and LED devices

Chongcook Kim; Taeyong Kim; Jong Kyu Kim

doi:10.1117/12.3000575

13 March 2024 Direct optical wiring (DOW)-based optical interconnects for optical communications using LD and LED devices

Chongcook Kim, Taeyong Kim, Jong Kyu Kim

Author Affiliations +

Proceedings Volume 12906, Light-Emitting Devices, Materials, and Applications XXVIII; 129060F (2024) https://doi.org/10.1117/12.3000575
Event: SPIE OPTO, 2024, San Francisco, California, United States

Abstract

We have developed Direct Optical Wiring (DOW) technology and successfully implemented it in chip-to-chip optical links in the form of commercially available products. The chip-to-chip optical coupling efficiencies using the DOWbased optical links exceed 93% in both in-plane and out-of-plane optical system, where the in-plane optical link includes vertical-cavity surface-emitting lasers (VCSELs) and photodiodes (PDs); and the out-of-plane one directly connects an edge-emitting laser diode to a PD. Such outstanding optical coupling is attributed to the minimized optical reflection and/or scattering in the end-to-end optical link, resulting in an improved bit error rate (BER). LESSENGERS® 800G QSFP-DD SR8 and 400G QSFP112 SR4 optical transceiver modules featuring DOW technology demonstrate the BER of ~ 5 × 10^-10 even at an elevated device temperature of 57°C.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Chongcook Kim, Taeyong Kim, and Jong Kyu Kim "Direct optical wiring (DOW)-based optical interconnects for optical communications using LD and LED devices", Proc. SPIE 12906, Light-Emitting Devices, Materials, and Applications XXVIII, 129060F (13 March 2024); https://doi.org/10.1117/12.3000575

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