Paper
6 February 2024 Simulation study on temperature field uniformity of ambient chamber of compound refrigeration system
Jilong Zhang, Dongfang Yang, Zhixin Li, Weiqing Zhou, Xian Zhou
Author Affiliations +
Proceedings Volume 12979, Ninth International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023); 129791S (2024) https://doi.org/10.1117/12.3015253
Event: 9th International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023), 2023, Guilin, China
Abstract
The environmental test box has tighter fluctuation, temperature field homogeneity, and other data criteria. First, clockwise and counterclockwise box structures from the temperature field were used to expand the seven box structure models. The angle, position, wind speed, and other structural parameters were used to simulate the box structures. The inner box structure consisted of the inner box structure with angles of zero degrees, 30 degrees, and 45 degrees from the vertical plane, the geometric center of the circular return air mouth at the center of the back plate, the center that was moved up by ten centimeters, down by ten centimeters, and in both directions by ten centimeters. A test prototype with circular return air in a geometric center construction verified the modeling results. The temperature average and standard deviation had a 0° clockwise angle, geometrically. The geometric center position anticlockwise, multi outlet model, and zero-degree angle clockwise had similar temperature averages and standard deviations across seven models. The entire measurement points averaged -71.55 degrees Celsius. The maximum temperature difference between measurement sites was 1.8 degrees Celsius, while the temperature error was -1.55 degrees Celsius. All points averaged -71.55 degrees Celsius. After the data were spread, temperatures in the temperature field followed a similar trend.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Jilong Zhang, Dongfang Yang, Zhixin Li, Weiqing Zhou, and Xian Zhou "Simulation study on temperature field uniformity of ambient chamber of compound refrigeration system", Proc. SPIE 12979, Ninth International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023), 129791S (6 February 2024); https://doi.org/10.1117/12.3015253
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