Research on LED junction temperature measurement method based on infrared thermal imaging

HaoDi Zhao; Junzhao Zhang; Chen Wang; Fan Li; Shuai Wang; Xiaofeng Lu; Zhongjian Hong

doi:10.1117/12.3015231

4 March 2024 Research on LED junction temperature measurement method based on infrared thermal imaging

HaoDi Zhao, Junzhao Zhang, Chen Wang, Fan Li, Shuai Wang, Xiaofeng Lu, Zhongjian Hong

Proceedings Volume 12981, Ninth International Symposium on Sensors, Mechatronics, and Automation System (ISSMAS 2023); 129812C (2024) https://doi.org/10.1117/12.3015231
Event: 9th International Symposium on Sensors, Mechatronics, and Automation (ISSMAS 2023), 2023, Nanjing, China

Abstract

This article analyzes the phenomenon of LED junction temperature changing with the circuit and environment, and proposes an improved measurement of LED junction temperature based on infrared thermal imaging method. By fitting the curve between heat transfer parameters and LED chip and packaging parameters, an LED experimental model is constructed, and junction temperature detection experiments and theoretical simulations are carried out. The results indicate that compared to traditional infrared thermal imaging methods, this method is more convenient and intuitive, and can quickly measure LED junction temperature. Finally, this article compares the LED junction temperature detection results under different experimental conditions to verify the universality of this method.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

HaoDi Zhao, Junzhao Zhang, Chen Wang, Fan Li, Shuai Wang, Xiaofeng Lu, and Zhongjian Hong "Research on LED junction temperature measurement method based on infrared thermal imaging", Proc. SPIE 12981, Ninth International Symposium on Sensors, Mechatronics, and Automation System (ISSMAS 2023), 129812C (4 March 2024); https://doi.org/10.1117/12.3015231

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