Architectural impact of patterned-overlay multichip module technologies

James C. Lyke

doi:10.1117/12.161441

20 October 1993 Architectural impact of patterned-overlay multichip module technologies

James C. Lyke

Proceedings Volume 1957, Architecture, Hardware, and Forward-Looking Infrared Issues in Automatic Target Recognition; (1993) https://doi.org/10.1117/12.161441
Event: Optical Engineering and Photonics in Aerospace Sensing, 1993, Orlando, FL, United States

Abstract

The advent of highly advanced multi-chip module (MCM) technologies makes it feasible to consider higher performance computer architectures optimized for a particular packaging approach. In particular, the High Density Interconnect (HDI) technology and related patterned overlay technologies allow for high bandwidth topologies to be constructed which are beyond the reach of many other packaging technologies. Through the use of the recently developed three-dimensional extensions of the HDI process, even more aggressive computer designs can be undertaken. Variations of the physical topologies that can be constructed with the two- and three-dimensional HDI processes provoke new paradigms in future high-performance computer construction.

Citation Download Citation

James C. Lyke "Architectural impact of patterned-overlay multichip module technologies", Proc. SPIE 1957, Architecture, Hardware, and Forward-Looking Infrared Issues in Automatic Target Recognition, (20 October 1993); https://doi.org/10.1117/12.161441

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