Picosecond transient absorption spectrometer for dynamic investigation of molecular photophysical processes

M. Szymanski; M. Balicki; E. Pawlowska; Franciszek K. Kaczmarek; Anthony A. Maciejewski; M. Binkowski

doi:10.1117/12.203320

1 March 1995 Picosecond transient absorption spectrometer for dynamic investigation of molecular photophysical processes

M. Szymanski, M. Balicki, E. Pawlowska, Franciszek K. Kaczmarek, Anthony A. Maciejewski, M. Binkowski

Author Affiliations +

Proceedings Volume 2202, Laser Technology IV: Research Trends, Instrumentation, and Applications in Metrology and Materials Processing; (1995) https://doi.org/10.1117/12.203320
Event: Laser Technology: Fourth Symposium, 1993, Szczecin, Poland

Abstract

A new experimental double beam system for dynamic studies of absorption transitions from initially populated excited states is described. In this system a high power picosecond YAG:Nd³⁺ laser (Quantel YG 570 C) equipped with generators of second, third, and fourth harmonics serves as an excitation source. The fundamental ((lambda) equals 1064 nm) beam is used for generation of the picosecond continuum which serves as an analyzing light. The temporal relation between incident beams is determined using both variable and fixed delay lines. A M-532.22 translation stage (POLYTEC) is used for micropositioning of a movable cube-corner prism in the optical delay line. A photomultiplier or an OMA detector are applied for measurements of the transient absorption dynamics. A PC 286 microcomputer controls the sequence of operation of all elements of the system and also processes the experimental data. The results of initial tests of this system are presented.

Citation Download Citation

M. Szymanski, M. Balicki, E. Pawlowska, Franciszek K. Kaczmarek, Anthony A. Maciejewski, and M. Binkowski "Picosecond transient absorption spectrometer for dynamic investigation of molecular photophysical processes", Proc. SPIE 2202, Laser Technology IV: Research Trends, Instrumentation, and Applications in Metrology and Materials Processing, (1 March 1995); https://doi.org/10.1117/12.203320

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