Paper
5 April 1995 Low-cost optical interconnect module for parallel optical data links
Chad Noddings, Tom J. Hirsch, M. Olla, C. Spooner, Jason J. Yu
Author Affiliations +
Abstract
We have designed, fabricated, and tested a prototype parallel ten-channel unidirectional optical data link. When scaled to production, we project that this technology will satisfy the following market penetration requirements: (1) up to 70 meters transmission distance, (2) at least 1 gigabyte/second data rate, and (3) $0.35 to $0.50 MByte/second volume selling price. These goals can be achieved by means of the assembly innovations described in this paper: a novel alignment method that is integrated with low-cost, few chip module packaging techniques, yielding high coupling and reducing the component count. Furthermore, high coupling efficiency increases projected reliability reducing the driver's power requirements.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chad Noddings, Tom J. Hirsch, M. Olla, C. Spooner, and Jason J. Yu "Low-cost optical interconnect module for parallel optical data links", Proc. SPIE 2400, Optoelectronic Interconnects III, (5 April 1995); https://doi.org/10.1117/12.206331
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KEYWORDS
Connectors

Vertical cavity surface emitting lasers

Prototyping

Optical interconnects

Packaging

Copper

Integrated optics

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