Preparation, structure, and properties of aluminium nitride (AIN) reinforced polymer composites: alternative substrate materials for microelectronic packaging

Xiao Hu; Juay Sim Koh; Peter Hing

doi:10.1117/12.280556

18 August 1997 Preparation, structure, and properties of aluminium nitride (AIN) reinforced polymer composites: alternative substrate materials for microelectronic packaging

Xiao Hu, Juay Sim Koh, Peter Hing

Author Affiliations +

Proceedings Volume 3184, Microelectronic Packaging and Laser Processing; (1997) https://doi.org/10.1117/12.280556
Event: ISMA '97 International Symposium on Microelectronics and Assembly, 1997, Singapore, Singapore

Abstract

A series of composite materials of varying compositions based on a high temperature resistance engineering thermotropic liquid crystalline polymer and particulate aluminium nitride (AlN) were compounded at relatively low temperature using a co-rotating twin screw extruder/compounder equipped with the segmented screws. The compounded composites are injection molded into different shapes, i.e., dumbbell, rectangular bar and cylindrical disk, for various physical and mechanical tests. In particular, detailed study was carried out to understand the effect of AlN on the dielectric constant, thermal conductivity and thermal expansion behavior of these materials. Results have shown that the thermal conductivity steadily increases with AlN filler concentration. An increase by about 80 percent in thermal conductivity of the composite materials is achieved as compared to the unfilled polymer. The dielectric constants of these composites were found to increase with filer content and range from 3.6 to 5.0 at 1 kHz and 3.0 to 4.2 at 10 MHz. Substantial reductio in thermal expansion coefficient was also achieved in the composite materials. Attempt has been made to correlate the experimental data with composite theories.

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Xiao Hu, Juay Sim Koh, and Peter Hing "Preparation, structure, and properties of aluminium nitride (AIN) reinforced polymer composites: alternative substrate materials for microelectronic packaging", Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); https://doi.org/10.1117/12.280556

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