Low-cost reliable transfer mold sensor packaging concept

Andre Bossche; Carmen V. B. Cotofana; P. Kaldenberg; I. Van Dommelen; Jeff R. Mollinger

doi:10.1117/12.284510

5 September 1997 Low-cost reliable transfer mold sensor packaging concept

Andre Bossche, Carmen V. B. Cotofana, P. Kaldenberg, I. Van Dommelen, Jeff R. Mollinger

Proceedings Volume 3224, Micromachined Devices and Components III; (1997) https://doi.org/10.1117/12.284510
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States

Abstract

This paper presents a low-cost transfer mould packaging concept for sensors, based on a direct-mold principle.The advantage of this method is that up to the molding step the whole process is compatible with standard lead-frame processing. The molding concept and package structures allow plastic sensor packaging with one or more environmental access paths to be created in a single molding step. As an application of the new packaging concept, a plastic sensor package with a single access path has been developed for commercial production. The performances of this new low cost package are satisfactory and reliability tests show good results. Furthermore, packaging of other types of sensors is in preparation.

Citation Download Citation

Andre Bossche, Carmen V. B. Cotofana, P. Kaldenberg, I. Van Dommelen, and Jeff R. Mollinger "Low-cost reliable transfer mold sensor packaging concept", Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); https://doi.org/10.1117/12.284510

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