Machine vision algorithms for semiconductor wafer inspection: a project with Inspex

Chi Hau Chen; Tzu-Hung Cheng; Wo-Tak Wu; Shawn Driscoll

doi:10.1117/12.326963

6 October 1998 Machine vision algorithms for semiconductor wafer inspection: a project with Inspex

Chi Hau Chen, Tzu-Hung Cheng, Wo-Tak Wu, Shawn Driscoll

Proceedings Volume 3521, Machine Vision Systems for Inspection and Metrology VII; (1998) https://doi.org/10.1117/12.326963
Event: Photonics East (ISAM, VVDC, IEMB), 1998, Boston, MA, United States

Abstract

With increased demand for reliable and automated semiconductor wafer inspection, machine vision techniques are much needed for defect extraction and identification and pre- and post-processing operations. The wavelet-based approach is emphasized in this paper for its capability to meet different needs in wafer inspection. The algorithms involved are illustrated by using a number of wafer inspection images.

Citation Download Citation

Chi Hau Chen, Tzu-Hung Cheng, Wo-Tak Wu, and Shawn Driscoll "Machine vision algorithms for semiconductor wafer inspection: a project with Inspex", Proc. SPIE 3521, Machine Vision Systems for Inspection and Metrology VII, (6 October 1998); https://doi.org/10.1117/12.326963

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