Laser drilling for improving circuit board manufacturing

Gang Yu; Jincheng Zhang; Chunlin Gao; Honcai Wang; Ping Li; Yongqiang An; Guiqiu Zhang

doi:10.1117/12.317889

15 August 1998 Laser drilling for improving circuit board manufacturing

Gang Yu, Jincheng Zhang, Chunlin Gao, Honcai Wang, Ping Li, Yongqiang An, Guiqiu Zhang

Proceedings Volume 3550, Laser Processing of Materials and Industrial Applications II; (1998) https://doi.org/10.1117/12.317889
Event: Photonics China '98, 1998, Beijing, China

Abstract

We reported here a novel technique for laser high speed drillings on Printed Circuit Boards (PCBs). A CNC solid laser based system is developed to drill through and blind vias as an alternative to mechanical drilling. The system employs an Acousto-Optic Q-switched Nd:YAG laser, a computer control system and an X-Y moving table which can handle up to 400 X 400 mm PCB. With a special designed cavity the laser system works in a pulsed operation in order to generate pulses with width down to 0.5 microseconds and maximum peak power over 10 kW at 10 k repetition rate. Delivered by an improved optical beam transforming system, the focused laser beam can drill holes including blind vias on PCBs with diameter in the range of 0.1 - 0.4 mm and at up to 300 - 500 vias per second (depending on the construction of PCBs). By means of a CNC X-Y moving system, laser pulses with pulse-to-pulse superior repeatability can be fired at desired location on a PCBs with high accuracy. This alternative technology for drilling through or blind vias on PCBs or PWBs (printed wiring boards) will obviously enhance the capability to printed boards manufacturing.

Citation Download Citation

Gang Yu, Jincheng Zhang, Chunlin Gao, Honcai Wang, Ping Li, Yongqiang An, and Guiqiu Zhang "Laser drilling for improving circuit board manufacturing", Proc. SPIE 3550, Laser Processing of Materials and Industrial Applications II, (15 August 1998); https://doi.org/10.1117/12.317889

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