Phase defect inspection of 130-nm node phase-shift masks using a simultaneous transmitted and reflected light pattern inspection algorithm

Larry S. Zurbrick; David Emery; Maciej W. Rudzinski; Mark J. Wihl; Michel Prudhomme M.D.; Christian Crell; Uwe A. Griesinger; Manuel Vorwerk; Mario Hennig

doi:10.1117/12.425092

9 April 2001 Phase defect inspection of 130-nm node phase-shift masks using a simultaneous transmitted and reflected light pattern inspection algorithm

Larry S. Zurbrick, David Emery, Maciej W. Rudzinski, Mark J. Wihl, Michel Prudhomme M.D., Christian Crell, Uwe A. Griesinger, Manuel Vorwerk, Mario Hennig

Author Affiliations +

Proceedings Volume 4349, 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents; (2001) https://doi.org/10.1117/12.425092
Event: 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents, 2000, Munich, Germany

Abstract

Phase shifting mask technology will be necessary to product integrated circuits at the 130 nm node using KrF wavelength steppers. In order to successfully accomplish this goal, it is necessary to detect and repair phase shifting defects that may occur in the manufacture of these reticles. An inspection algorithm has been developed to improve the phase shift defect detection rate of an UV reticle inspection system and is based upon the simultaneous use of the transmitted and reflected light signals. This paper describes the phase defect sensitivity improvement over transmitted light only pattern inspection results and simultaneous transmitted and reflected light based contamination inspection results.

Citation Download Citation

Larry S. Zurbrick, David Emery, Maciej W. Rudzinski, Mark J. Wihl, Michel Prudhomme M.D., Christian Crell, Uwe A. Griesinger, Manuel Vorwerk, and Mario Hennig "Phase defect inspection of 130-nm node phase-shift masks using a simultaneous transmitted and reflected light pattern inspection algorithm", Proc. SPIE 4349, 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (9 April 2001); https://doi.org/10.1117/12.425092

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available