Challenges of packaging MEMS components for the all-optical networks of the future

Ronald E. Scotti; Nagesh R. Basavanhally; Yee L. Low; David A. Ramsey; David J. Bishop

doi:10.1117/12.425362

5 April 2001 Challenges of packaging MEMS components for the all-optical networks of the future

Ronald E. Scotti, Nagesh R. Basavanhally, Yee L. Low, David A. Ramsey, David J. Bishop

Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001) https://doi.org/10.1117/12.425362
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France

Abstract

Micro-optoelectromechanical systems (MOEMS) having valuable performance, size, and cost attributes offer novel solutions to the design of lightwave network elements. We will discuss the new challenges that realizing these benefits presents to the field of photonic packaging.

Citation Download Citation

Ronald E. Scotti, Nagesh R. Basavanhally, Yee L. Low, David A. Ramsey, and David J. Bishop "Challenges of packaging MEMS components for the all-optical networks of the future", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); https://doi.org/10.1117/12.425362

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