A novel application of the solid electrolyte thin film for preparing copper nanowires

Shuo Shi; Jia-Lin Sun; Guo-Sheng Zhang; Jian-Hong Zhang; Ji-Hua Guo; Zheng-Ping Wang

doi:10.1117/12.607384

8 December 2004 A novel application of the solid electrolyte thin film for preparing copper nanowires

Shuo Shi, Jia-Lin Sun, Guo-Sheng Zhang, Jian-Hong Zhang, Ji-Hua Guo, Zheng-Ping Wang

Proceedings Volume 5774, Fifth International Conference on Thin Film Physics and Applications; (2004) https://doi.org/10.1117/12.607384
Event: Fifth International Conference on Thin Film Physics and Applications, 2004, Shanghai, China

Abstract

We report a novel application of the solid electrolyte K-Cu-I thin film for preparing copper nanowires. The K-Cu-I film was prepared by depositing a mixture of KI and CuI powders on a heated glass substrate in vacuum and had a copper ion conductivity of 1.5x10^-3Ω^-1cm-1 at 540K. At 540K, being applied a direct current (DC) electric field of 1.0x10⁴ V/m, the copper ions migrated toward cathode through the K-Cu-I film and congregated to form nanowires at the edge of the cathode. The copper nanowires were about 40~100nm in diameter and several micrometers in length.

Citation Download Citation

Shuo Shi, Jia-Lin Sun, Guo-Sheng Zhang, Jian-Hong Zhang, Ji-Hua Guo, and Zheng-Ping Wang "A novel application of the solid electrolyte thin film for preparing copper nanowires", Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); https://doi.org/10.1117/12.607384

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