Paper
20 October 2006 PPC model build methodology: sequential litho and etch verification
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Abstract
We present a methodology for building through-process, physics-based litho and etch models which result in accurate and predictive models. The litho model parameters are inverted using resist SEM data collected on a set of test-structures for a set of exposure dose and defocus conditions. The litho model includes effects such as resist diffusion, chromatic aberration, defocus bias, lens aberrations, and flare. The etch model, which includes pattern density and particle collision effects, is calibrated independently of the litho model, using DI and FI SEM measurements. Before being used for mask optimization, the litho and etch models are signed-off using a set of verification structures. These verification structures, having highly two-dimensional geometries, are placed on the test-reticle in close vicinity to the calibration test-structures. Using through-process DI and FI measurement and images from verification structures, model prediction is compared to wafer results, and model performance both in terms of accuracy and predictability is thus evaluated.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ali Mokhberi, Vishnu Kamat, Apo Sezginer, Franz X. Zach, Gökhan Perçin, Jesus Carrero, and Hsu-Ting Huang "PPC model build methodology: sequential litho and etch verification", Proc. SPIE 6349, Photomask Technology 2006, 63491Z (20 October 2006); https://doi.org/10.1117/12.692931
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KEYWORDS
Etching

Calibration

Data modeling

Semiconducting wafers

Particles

Scanning electron microscopy

Chromatic aberrations

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