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22 May 2007 Novel way of microreliefs fabrication for MEMS
Yu. Timoshkov, A. Stognij, V. Timoshkov, V. Kurmashev
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Proceedings Volume 6637, XV International Symposium on Advanced Display Technologies; 66370K (2007) https://doi.org/10.1117/12.742606
Event: XV International Symposium on Advanced Display Technologies, 2006, Moscow, Russian Federation
Abstract
The main goal of this work is low-cost technologies for precision microrelief production developed using common microelectronics materials and equipment. Three technologies of microrelief formation were worked out: polyimide, porous silicon, and porous alumina. Microreliefs were fabricated using nanocomposite materials instead of homogeneous metals, i.e. co-deposited metal matrix with inert ultra-fine particles by electroless or plating processes. Microreliefstructures were produced and tested in view of application for display and optical systems.
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Yu. Timoshkov, A. Stognij, V. Timoshkov, and V. Kurmashev "Novel way of microreliefs fabrication for MEMS", Proc. SPIE 6637, XV International Symposium on Advanced Display Technologies, 66370K (22 May 2007); https://doi.org/10.1117/12.742606
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KEYWORDS
Microelectromechanical systems
Particles
Silicon
Chemical elements
Metals
Nanocomposites
Composites
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