A novel approach to fabricate three-dimensional carbon-based interconnect for micro/nano optoelectronic integration

Ping Peng; Zirong Tang; Tielin Shi; Guanglan Liao; Jie Gong; Yuanyuan Yao

doi:10.1117/12.823166

19 February 2009 A novel approach to fabricate three-dimensional carbon-based interconnect for micro/nano optoelectronic integration

Ping Peng, Zirong Tang, Tielin Shi, Guanglan Liao, Jie Gong, Yuanyuan Yao

Author Affiliations +

Proceedings Volume 7279, Photonics and Optoelectronics Meetings (POEM) 2008: Optoelectronic Devices and Integration; 72791C (2009) https://doi.org/10.1117/12.823166
Event: Photonics and Optoelectronics Meetings, 2008, Wuhan, China

Abstract

Carbon-based micro/nano materials and structures such as carbon nanofibers (CNFs) and carbon nanotubes (CNTs) have attracted a wide spread attention and been widely studied since it was invented because of its excellent electrical properties, remarkable mechanical strength, thermal conductivity, chemical inertness and special optical properties. However, it still remains a crucial problem in applying and characterizing of carbon-based micro/nano optoelectronic devices, since it is difficult to realize interconnection of these micro/nanostructures such as CNTs for device integration. Recently, it was reported that CNFs and CNTs can be fabricated and integrated with 3-dimensional carbon electrodes through modified photolithography and pyrolyzed process. Following this work, a novel approach is introduced to fabricate suspended micro/nano wires between electrodes which can be a promising method as interconnects for CNTbased devices. This paper briefly presents the process, experimental results and discussions for fabrication of suspended 3-dimensional carbon interconnects. By dispersion of special nanoparticles with thick film SU-8 photoresist, suspended carbon interconnects can be obtained between 3-dimensional adjacent carbon posts during photolithography process with masking effect. Then, further work can be continued with fabrication of CNTs or CNFs over the structures through controlled pyrolysis process.

Citation Download Citation

Ping Peng, Zirong Tang, Tielin Shi, Guanglan Liao, Jie Gong, and Yuanyuan Yao "A novel approach to fabricate three-dimensional carbon-based interconnect for micro/nano optoelectronic integration", Proc. SPIE 7279, Photonics and Optoelectronics Meetings (POEM) 2008: Optoelectronic Devices and Integration, 72791C (19 February 2009); https://doi.org/10.1117/12.823166

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KEYWORDS

Carbon

Photoresist materials

Optical lithography

Optoelectronic devices

Electrodes

Carbon nanotubes

Optoelectronics integration

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