Environmental sustainability applied to lithography and photomasks

Emily E. Gallagher

doi:10.1117/12.2643305

16 November 2022 Environmental sustainability applied to lithography and photomasks

Emily E. Gallagher

Proceedings Volume PC12293, Photomask Technology 2022; PC1229309 (2022) https://doi.org/10.1117/12.2643305
Event: SPIE Photomask Technology + EUV Lithography, 2022, Monterey, California, United States

Abstract

Sustainability is gaining momentum in high-tech industry with large companies announcing targets for net-zero carbon emissions by the middle of this century. Existing logic process flows are coupled with tool and process information to identify equivalent carbon (CO2,eq) trends in logic technology nodes with focus on the impact of lithography. The relative footprint of lithography relative to other process steps will be shown for advanced logic nodes. Comparing 28nm to 1.4nm logic flows, lithographic steps have become the largest contributor to total emissions. With this growing importance, more scrutiny of assumptions and mitigation is needed. In this paper, lithographic and mask process variables will be used to identify levers available to the lithographic community to reduce the semiconductor manufacturing carbon footprint.

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Emily E. Gallagher "Environmental sustainability applied to lithography and photomasks", Proc. SPIE PC12293, Photomask Technology 2022, PC1229309 (16 November 2022); https://doi.org/10.1117/12.2643305

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KEYWORDS

Lithography

Semiconducting wafers

Photomasks

Carbon

Logic

Scanners

Reticles

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