Presentation
30 April 2023 Development of nanoimprint templates for dual damascene processing
Takaharu Nagai, Hisayoshi Watanabe, Koji Ichimura
Author Affiliations +
Abstract
Nanoimprint lithography, NIL, has been developed for semiconductor lithography technology. Recently, cost-effective process for metal interconnects is one of the main challenges to keep scaling at a certain range of cost. Since NIL has the advantage on the resolution of interconnect patterns without design restriction and potential of transferring three-dimensional shapes, dual damascene by NIL which realize the process of metal interconnects and vias with single lithography step has been proposed. In this presentation, we will discuss the performance of our template for dual damascene processing targeting sub 20nm half pitch.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takaharu Nagai, Hisayoshi Watanabe, and Koji Ichimura "Development of nanoimprint templates for dual damascene processing", Proc. SPIE PC12497, Novel Patterning Technologies 2023, PC1249708 (30 April 2023); https://doi.org/10.1117/12.2661643
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KEYWORDS
Nanoimprint lithography

Lithography

Metals

3D acquisition

Double patterning technology

Extreme ultraviolet

Extreme ultraviolet lithography

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