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Radicals have been effectively used for photoresist removal for many decades, however, most radical treatments have an energy distribution with high energy tails. This contributes to unwanted surface change or damage of other exposed materials. Tighter energy control is needed. We propose an ultra-low energy radical treatment with sufficient energy for surface modification but also a tighter energy distribution that minimizes unwanted film damage or loss. In this method, a reactive chemistry is introduced below the plasma generation region so that reactive radicals are generated indirectly though collision with inert metastable species.
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Seung Park, Yong Hee Choi, David Lo, Mark Kawaguchi, Christine Das, "Ultra-low energy radical treatments for advanced 3D device structures," Proc. SPIE PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, PC124990C (30 April 2023); https://doi.org/10.1117/12.2659121