|
Heterogeneous Integration (HI) is a powerful and crucial enabler for the continued growth of computing and communication performance. Advanced packaging technologies are critical enablers of HI because of their importance as compact, power efficient platforms. This talk will focus on the tremendous opportunities in different application environments and focus on the projected evolution of advanced packaging architectures. Interest in HI research has picked up in recent years and this opens up greater collaboration opportunities between academia and industry. Specific examples, showing how product implementations take advantage of currently available HI technologies, to provide an unprecedented level of performance, will be used to describe the challenges and opportunities in developing robust, next generation advanced package architectures. A broad scope roadmap of the future generated as part of an industry-academic collaboration will be discussed in this context to highlight the opportunities generated by HI. Opportunities in physical interconnect scaling, an important part of the HI Roadmap will be discussed in detail with a focus on processes to create fine pitch, high performance interconnects.
|
