My Subscription | My Email Alerts | My Article Collections

BROWSE PROCEEDINGS

Proceedings

BROWSE JOURNALS

Journals

BROWSE SPIE eBOOKS

SPIE eBooks

SUBSCRIPTIONS & PRICING

GENERAL INFORMATION

Back Matter

from: Advanced Processes for 193-nm Immersion Lithography

Author(s): Yayi Wei, Robert L. Brainard

Published: 19 February 2009

Chapter DOI: http://dx.doi.org/10.1117/3.820233.bm

Chapter Page Count: 10 pages

Previous Chapter

Front Matter

1. Immersion Lithography and Its Challenges

2. Process Steps in the Track

3. Resist Leaching and Water Uptake

4. Contact Angle of Water on Resist Stacks

5. Topcoat and Resist Processes for Immersion Lithography

6. Immersion Defects and Defect-Reduction Strategies

7. Antireflection Coatings and Underlayer Technology

8. Resist Shrink and Trim Processes

9. Double Exposure and Double Patterning

10. Line-Edge Roughness of Resist Patterns

11. Extendibility of 193-nm Immersion Lithography

Back Matter

Preview

Excerpt

This back matter contains the index and author biographies.

http://dx.doi.org/10.1117/3.820233.bm

OPEN ACCESS - FREE

Connotea

del.icio.us

BibSonomy

	EMAIL PREVIEW		RESEARCH TOOLKIT
	BLOG THIS CHAPTER		DOWNLOAD CITATION

BOOK DATA

Print ISBN:

9780819475572

eISBN:

9780819478436

Publisher:

SPIE Press

View presentations in solar, OLEDs, and more