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Front Matter

from: Advanced Processes for 193-nm Immersion Lithography

Author(s): Yayi Wei, Robert L. Brainard

Published: 19 February 2009

Chapter DOI: http://dx.doi.org/10.1117/3.820233.fm

Chapter Page Count: 16 pages

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Front Matter

1. Immersion Lithography and Its Challenges

2. Process Steps in the Track

3. Resist Leaching and Water Uptake

4. Contact Angle of Water on Resist Stacks

5. Topcoat and Resist Processes for Immersion Lithography

6. Immersion Defects and Defect-Reduction Strategies

7. Antireflection Coatings and Underlayer Technology

8. Resist Shrink and Trim Processes

9. Double Exposure and Double Patterning

10. Line-Edge Roughness of Resist Patterns

11. Extendibility of 193-nm Immersion Lithography

Back Matter

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This front matter contains the table of contents, preface, acknowledgments, and list of acronyms and abbreviations.

http://dx.doi.org/10.1117/3.820233.fm

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BOOK DATA

Print ISBN:

9780819475572

eISBN:

9780819478436

Publisher:

SPIE Press

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