Bonding of polydimethylsiloxane microfluidics to silicon-based sensors

Tsai, Long-Fang; Dahlquist, William C.; Kim, Seunghyun; Nordin, Gregory P.

doi:doi:10.1117/1.3659139

GENERAL INFORMATION

You are not logged in Logged Out Log In

Journal of Micro/Nanolithography, MEMS, and MOEMS / Volume 10 / Issue 4 / Articles

Previous Article | Next Article

Bonding of polydimethylsiloxane microfluidics to silicon-based sensors

J. Micro/Nanolith. MEMS MOEMS 10, 043009 (Nov 21, 2011); http://dx.doi.org/10.1117/1.3659139

Alerts
- Alert Me When Cited
- Alert Me When Corrected
Tools
Share
- Email Abstract
- Connotea
- CiteULike
- del.icio.us
- BibSonomy
- Tweet this Article
- Add to Facebook

Abstract

References (14)

Citing Articles (1)

Long-Fang Tsai, William C. Dahlquist, Seunghyun Kim, and Gregory P. Nordin

Brigham Young University, Electrical and Computer Engineering, Provo, Utah 84602

We investigate bonding polydimethylsiloxane (PDMS) to silicon using a thin (∼2 μm) intermediate adhesive layer stamped onto a PDMS piece prior to bonding. In particular, we compare as adhesive layers Sylgard 184 and 182 curing agents and a UV curable adhesive (NOA 75). We examine the effect of both curing temperature and duration on curing agent bond strength. Bond strengths for the different adhesives are determined by measuring the average burst pressure at a PDMS-silicon interface using a PDMS test design. We find that Sylgard 184 curing agent gives the highest bond strength with burst pressure of 700 kPa or more for curing at either 60°C for 3 h, 70°C for 30 min, or 90°C for 20 min. Curing at room temperature takes substantially more time with an average burst pressure of 433 and 555 kPa for curing times of 16 and 27 h, respectively. In comparison, Sylgard 182 curing agent takes 32 h at room temperature to achieve a burst pressure of 289 kPa, while NOA 75 with a 50°C 12 h post-UV exposure bake yields a burst pressure of 125 kPa.

History

Received Jan 03, 2011
Accepted Oct 17, 2011
Revised Aug 25, 2011
Published online Nov 21, 2011

Digital Object Identifier

http://dx.doi.org/10.1117/1.3659139

Citation

Long-Fang Tsai, William C. Dahlquist, Seunghyun Kim and Gregory P. Nordin, "Bonding of polydimethylsiloxane microfluidics to silicon-based sensors", J. Micro/Nanolith. MEMS MOEMS 10, 043009 (Nov 21, 2011); http://dx.doi.org/10.1117/1.3659139