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April - June 2012

Volume 11, Issue 2 (partial)

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Special Section on EUV Sources for Lithography
Special Section on Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS III
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Select this Article		New type of discharge-produced plasma source for extreme ultraviolet based on liquid tin jet electrodes Konstantin Koshelev, Vladimir Krivtsun, Vladimir Ivanov, Oleg Yakushev, Alexey Chekmarev, Vsevolod Koloshnikov, Evegenii Snegirev, and Viacheslav Medvedev J. Micro/Nanolith. MEMS MOEMS 11, 021103 (May 16, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021103 Online Publication Date: May 16, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract A new approach for discharge-produced plasma (DPP) extreme ultraviolet (EUV) sources based on the usage of two liquid metallic alloy jets as discharge electrodes has been proposed and tested. Discharge was ignited using laser ablation of one of the cathode jets. A system with two jet electrodes was tested at a repetition rate of 1 to 5 kHz with dissipated electrical power up to 20 kW. Radiating spectra, time characteristics, and conversion efficiency are similar to conventional DPP schemes with rotating wheels. In the first experiments, the Ga:Sn eutectic alloy, which is liquid at room temperature, was circulating in a closed loop. The high velocity of the jets (30 m/s) ensures a renewed electrode surface for every shot, for a repetition rate frequency of up to 30 to 50 kHz, and provides effective heat transportation from the discharge zone. Modeling and experiments demonstrate that the proposed scheme is able to dissipate up to 200 kW of electrical power without overheating the nozzles and tin surface. It was found that the flexible electrode configuration allows the channeling of essential parts of debris plasma in directions opposite to the EUV collector.

Select this Article		Out-of-band radiation mitigation at 10.6 μm by molecular absorbers in laser-produced plasma extreme ultraviolet sources Chimaobi Mbanaso, Alin Antohe, Horace Bull, Frank Goodwin, Ady Hershcovitch, and Gregory Denbeaux J. Micro/Nanolith. MEMS MOEMS 11, 021116 (May 10, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021116 Online Publication Date: May 10, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract Out-of-band radiation in extreme ultraviolet (EUV) exposure tools remains one of the critical issues that must be addressed before the implementation of this lithography technique for high-volume manufacturing. The out-of-band spectrum at the intermediate focus of EUV sources that use a CO₂ laser-produced plasma is dominated by scattered radiation from the drive laser, which operates near 10.6-μm wavelength. To reduce the unwanted heating of optical components in the exposure tool caused by the infrared wavelength, a 10.6-μm wavelength-absorbing gas can be used to reduce the number of photons at this wavelength reaching the intermediate focus. Gaseous sulfur hexafluoride (SF₆), whose υ₃ infrared active mode is vibrationally excited by radiation around 10.6-μm wavelength, can be used to function as a molecular absorber and thus, mitigate part of the infrared radiation. In this work, the optical absorption of gaseous SF₆ is experimentally investigated at the CO₂ laser wavelengths close to 10.6 μm as well as the EUV wavelength. Various considerations affecting the use of a gas-based spectral filter are also discussed in this paper.

Select this Article		Atomic-hydrogen cleaning of Sn from Mo/Si and DLC/Si extreme ultraviolet multilayer mirrors Wouter A. Soer, Maarten M. J. W. van Herpen, Martin J. J. Jak, Peter Gawlitza, Stefan Braun, Nikolay N. Salashchenko, Nikolay I. Chkhalo, and Vadim Y. Banine J. Micro/Nanolith. MEMS MOEMS 11, 021118 (May 03, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021118 Online Publication Date: May 03, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract We have investigated the use of atomic-hydrogen-based cleaning to remove Sn contamination from extreme ultraviolet (EUV) multilayer mirrors. Mo and Si surfaces were cleaned at a relatively slow rate due to catalyzed dissociation of tin hydride on these surfaces. Mo/Si mirrors with B₄C and Si₃N₄ cap layers and DLC-terminated DLC/Si mirrors showed complete removal of 10 nm Sn in 20 sec with full restoration of EUV reflectance. In addition, a prolonged cleaning treatment of 300 sec of a DLC/Si mirror resulted in only a minor EUV peak reflection loss of 1.2% absolute and no significant changes in infrared reflectance.

Select this Article		Extreme ultraviolet lasers: principles and potential for next-generation lithography Juerg E. Balmer, Davide Bleiner, and Felix Staub J. Micro/Nanolith. MEMS MOEMS 11, 021119 (May 10, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021119 Online Publication Date: May 10, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract Extreme ultraviolet (EUV) lasers in the wavelength range of ∼ 10 to 20 nm have matured to a point where dedicated applications such as at-wavelength inspection of extreme-ultraviolet lithography (EUVL) masks become possible on the laboratory scale. The authors briefly review the principles of plasma-based EUV lasers, the progress made so far, and the output characteristics of interest to the EUVL community.

Select this Article		Design of high brightness laser-Compton source for extreme ultraviolet and soft x-ray wavelengths Kazuyuki Sakaue, Akira Endo, and Masakazu Washio J. Micro/Nanolith. MEMS MOEMS 11, 021124 (May 03, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021124 Online Publication Date: May 03, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract Design of a clean, high-brightness light source is presented for extreme ultraviolet/soft x-ray (EUV/SXR) lithography research and mask inspection. Basic characteristics of classical laser-Compton scattering are reviewed, and the laser and electron beam parameters at relatively low energy (EUV to SXR) photon generation are optimized. Recent achievements in each component technology are evaluated on a continuous wave (CW)-operated electron linac and energy recovery linac system, based on superconducting technologies at a 1.3 GHz operation frequency, 10 kW average power, short pulse CO₂ laser, and optical super cavity with a 600- enhancement- factor at 10.6 μm wavelength. Combining both the CW electron beam and short pulse CO₂ laser with super-cavity enhancement, 1 mW/2% ?startb.w.end? flux and 30 kW/mm²/sr/2% ?startb.w.end? brightness laser-Compton source is designed at 6.7-nm wavelength. The technological gap in the present component technologies are discussed, as well as any further required developments.

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BROWSE VOLUMES

April - June 2012

Volume 11, Issue 2 (partial)

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Select this Article		Packaging of MEMS and MOEMS for harsh environments Julian Kähler, Andrej Stranz, Andreas Waag, and Erwin Peiner J. Micro/Nanolith. MEMS MOEMS 11, 021202 (May 07, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021202 Online Publication Date: May 07, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract A method for die-attach based on sintering of micro- and nano-silver-particles, which is stable in harsh environments, was described. A modified flip-chip bonder providing high placement accuracy was used for precise pick and place die-attach. Components of sensors designed for data logging during deep drilling, i.e., a MEMS vibration sensor and a MOEMS pressure sensor, were assembled and tested at temperatures up to 250°C. Shear tests of bonded devices were performed before and after temperature load. Bonded silicon-on-insulator Wheatstone bridges and GaP-PD were tested by temperature cycling (50 cycles from 100°C up to 250°C).

Select this Article		Effect of added mass using resonant peak shifting technique Rajesh Kumar Burra, Jyothi Vankara, and D. V. Rama Kota Reddy J. Micro/Nanolith. MEMS MOEMS 11, 021203 (May 10, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021203 Online Publication Date: May 10, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract Microcantilever is the fundamental structure for the realization of a microelectromechanical systems sensor with higher sensitivity and selectivity in a number of fields like biomedical, defense, and environmental. Present research is also focusing on the applications of microcantilever in the field of food industry. Among the two fundamental techniques for microcantilever, deflection and resonant peak shift, it was proven that the latter one is the best suited for added mass detection. In our study, we derive an analytical expression for δm based on the shift in frequency (δf') that accounts for the elasticity of the added mass and the location of the mass on the beam. In particular, we create a finite element methods model of our system in a commercial package, COMSOL (Bangalore, India), and carry out modal analysis for the cantilever beam resonator with and without the added mass, varying the relative stiffness and mass of the two components (the cantilever beam and the added mass), to compare the results of shift in resonant frequency with those obtained from rigid mass models. The results show the effect of elasticity clearly in certain ranges of relative stiffness and mass.

Select this Article		Reliability test methodology for MEMS and MOEMS under electrical overstress and electrostatic discharge stress Sandeep Sangameswaran, Jeroen De Coster, Guido Groeseneken, and Ingrid De Wolf J. Micro/Nanolith. MEMS MOEMS 11, 021204 (May 14, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021204 Online Publication Date: May 14, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract We present an integrated reliability test methodology for electrostatic discharge (ESD) testing of micro-electromechanical systems (MEMS). It is shown that conventional ESD test methods for failure detection, like current and voltage waveforms during ESD stress and direct current leakage are insufficient for MEMS. A functionality-based approach using the mechanical response of the MEMS during ESD is needed to accurately and conclusively detect ESD failure in MEMS. A novel test setup with a probe-mountable human body model (HBM) tester is presented for this purpose. This setup can perform simultaneous measurements of MEMS out-of-plane displacement, HBM current and HBM voltage in the MEMS in situ during ESD stress. Using this setup, a few examples are demonstrated that show that traditional electrical characterization is overestimating the ESD robustness of MEMS devices. ESD testing of MEMS is performed at different pressures on RF MEMS actuators and show that more than one type of failure mechanism can occur due to ESD stress. ESD-induced charging and functionality degradation in RF MEMS actuators are also briefly discussed.

Select this Article		Parameter extraction of MEMS comb-drive near-resonance equivalent circuit: physically-based technique for a unique solution Yasser Sabry, Mostafa Medhat, Bassam Saadany, Tarik Bourouina, and Diaa Khalil J. Micro/Nanolith. MEMS MOEMS 11, 021205 (May 07, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021205 Online Publication Date: May 07, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract A new extraction approach for MEMS comb-drive equivalent circuit parameters is presented. The proposed method eliminates the need for fitting and optimization by direct extraction from the measured data and, thus, avoids the nonuniqueness problem associated with fitting algorithms. A silicon-on-insulator-based MEMS comb-drive actuator is designed, fabricated, and measured, and its equivalent circuit is obtained by the proposed procedure. Analytical estimation for the uncertainty in the extracted values due to the discrete nature of the measurement frequency resolution is carried out. Uncertainty in the extracted values of the equivalent motional parameters is well below 0.6% when a 0.1-Hz frequency resolution is used. The method has been used to extract the resonator quality factor at both atmospheric and vacuum operations and can be extended to other types of resonators.

Select this Article		Frequency effects and life prediction of polysilicon microcantilever beams in bending fatigue Jeng-Nan Hung and Hong Hocheng J. Micro/Nanolith. MEMS MOEMS 11, 021206 (May 11, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021206 Online Publication Date: May 11, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract Microcantilever beams have been widely used in micro-electromechanical systems (MEMS) devices. Their reliability is an essential factor for a successful MEMS product in an industrial setting. This study discusses the fatigue life of polysilicon microcantilever beams of various dimensions that were subjected to bending by a piezoelectric actuator. Both experimental and analytical results were obtained. A 100-Hz piezoelectric actuator was used to facilitate the test runs with good repeatability of the fatigue load. A finite element-modeling program, ANSYS, was used to investigate the stress distribution on the microcantilever beam. The fatigue life of the specimen was found to lie between 1.23×10⁷ and 1.29×10⁸ cycles for stress level ranges from 4.07 to 2.31 GPa. The experimental data from this study were incorporated with published references into an S-N curve, which showed that the fatigue life was dependent on both stress and frequency levels of the loading cycles. Low frequency loading was associated with increased sensitivity of fatigue life versus stress level. An empirical correlation was established for predicting fatigue to provide the MEMS designer with a reference for various applications.

Select this Article		Analytical design of polymer-encapsulated radio frequency microelectromechanical devices Pejman Monajemi J. Micro/Nanolith. MEMS MOEMS 11, 021207 (May 10, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.021207 Online Publication Date: May 10, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract An analytical design of radio frequency microelectromechanical (RF MEMS) devices and fabrication and encapsulation results is discussed. The encapsulated MEMS device is an in-plane variable capacitor (varactor), continuously tuned up to 115% at 3.25 V, showing a Q factor of 49 at 1 GHz at zero bias and self-resonance frequency above 5 GHz. The 60-μm-thick device measures 0.6 mm×0.6 mm and is fabricated using high-aspect ratio single-crystal and polysilicon technology, having an air gap of 0.8 μm for tuning and 2 μm for actuation. The effect of gap size, substrate doping, and gold coating on Q is studied. The wafer-level encapsulation is done by the thermal decomposition of a sacrificial polymer through a polymer overcoat at 130°C–150°C, followed by gold evaporation to provide a degree of hermeticity. The overcoat polymer is patterned instead of screen printed, which defines the package boundary, providing a small amount of interconnection. The encapsulated device measures 0.7 mm×0.7 mm, which is only 35% larger than the MEMS device. The insertion loss of the 1 μm/20 μm gold/Avatrel package is measured to be 1.4 dB at 1 GHz and 1.51 dB at 5 GHz, and the calculated nitrogen permeability is less than 1 Barrer. The temperature stability of the rest and the maximum capacitance is better than 7%, in the range of −30–50 °C.

Select this Article OPEN ACCESS		Conformal coating of poly-glycidyl methacrylate as lithographic polymer via initiated chemical vapor deposition Shinya Yoshida, Tatsuya Kobayashi, Masafumi Kumano, and Masayoshi Esashi J. Micro/Nanolith. MEMS MOEMS 11, 023001 (May 14, 2012); http://dx.doi.org/10.1117/1.JMM.11.2.023001 Online Publication Date: May 14, 2012 Full Text: Read Online (HTML) \| Download PDF
	+ -	Show Abstract This study reports on the investigation of the potential applicability of poly-glycidyl methacrylate (PGMA) films deposited via initiated chemical vapor deposition (i-CVD) as lithographic resists in the microfabrication of non-planar structures. We investigate the appropriate deposition conditions of i-CVD required to form PGMA films with smooth surfaces. As a result, under the optimal conditions determined by us, we fabricate films with nanometer-scale flat surfaces. Subsequently, we demonstrate that i-CVD is effective for conformally coating a high-aspect-ratio Si trench with PGMA film via our deposition experiments. In our deep-ultraviolet lithography experiment, we successfully fabricate a fine 20-μm line-and-space (L/S) pattern with a height of approximately 1 μm. Furthermore, in our electron-beam (EB) lithography experiment, we define a fine 350-nm L/S pattern with a height of 120 nm. In addition, the i-CVD process can be used to form highly-sensitive EB resist films; the lowest dose amount for patterning these films is evaluated to be less than 0.01 μC/cm². Our results demonstrate that i-CVD is a potentially powerful method to conformally coat lithographic resist films on three-dimensional structures.