Mr. Callum J. C. Heath Profile

Callum J. C. Heath

PhD Student at Univ of Bristol

SPIE Involvement:

Author

Publications (2)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 15 April 2016 Presentation + Paper

Variable stiffness sandwich panels using electrostatic interlocking core

Callum J. Heath, Ian Bond, Kevin Potter

Proceedings Volume 9799, 97992A (2016) https://doi.org/10.1117/12.2218835

KEYWORDS: Electrodes, Fiber reinforced polymers, Adhesives, Modulation, Composites, Polymers, Foam, Thin films, Dielectrics, Surface finishing, Ions, Epoxies

Read Abstract +

Structural topology has a large impact on the flexural stiffness of a beam structure. Reversible attachment between discrete substructures allows for control of shear stress transfer between structural elements, thus stiffness modulation. Electrostatic adhesion has shown promise for providing a reversible latching mechanism for controllable internal connectivity. Building on previous research, a thin film copper polyimide laminate has been used to incorporate high voltage electrodes to Fibre Reinforced Polymer (FRP) sandwich structures. The level of electrostatic holding force across the electrode interface is key to the achievable level of stiffness modulation. The use of non-flat interlocking core structures can allow for a significant increase in electrode contact area for a given core geometry, thus a greater electrostatic holding force. Interlocking core geometries based on cosine waves can be Computer Numerical Control (CNC) machined from Rohacell IGF 110 Foam core. These Interlocking Core structures could allow for enhanced variable stiffness functionality compared to basic planar electrodes. This novel concept could open up potential new applications for electrostatically induced variable stiffness structures.

Proceedings Article | 1 April 2015 Paper

Integrating electrostatic adhesion to composite structures

Callum Heath, Ian Bond, Kevin Potter

Proceedings Volume 9433, 94330D (2015) https://doi.org/10.1117/12.2084073

KEYWORDS: Composites, Dielectrics, Electrodes, Fiber reinforced polymers, Silicon, Manufacturing, Electroluminescence, Epoxies, Neodymium, Etching

Read Abstract +

Additional functionality within load bearing components holds potential for adding value to a structure, design or product. We consider the adaptation of an established technology, electrostatic adhesion or electroadhesion, for application in glass fibre reinforced polymer (GFRP) composite materials. Electroadhesion uses high potential difference (~2-3 kV) between co-planar electrodes to generate temporary holding forces to both electrically conductive and nonconductive contact surfaces. Using a combination of established fabrication techniques, electroadhesive elements are co-cured within a composite host structure during manufacture. This provides an almost symbiotic relationship between the electroadhesive and the composite structure, with the electroadhesive providing an additional functionality, whilst the epoxy matrix material of the composite acts as a dielectric for the high voltage electrodes of the device. Silicone rubber coated devices have been shown to offer high shear load (85kPa) capability for GFRP components held together using this technique. Through careful control of the connection interface, we consider the incorporation of these devices within complete composite structures for additional functionality. The ability to vary the internal connectivity of structural elements could allow for incremental changes in connectivity between discrete sub-structures, potentially introducing variable stiffness to the global structure.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years