Dr. Cheng-Wen Wu
General Director, SOC Technology Ctr at Industrial Technology Research Institute
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 8 December 2009 Paper
Ding-Ming Kwai, Cheng-Wen Wu
Proceedings Volume 7520, 752003 (2009) https://doi.org/10.1117/12.845747
KEYWORDS: Front end of line, Back end of line, System on a chip, Metals, Manufacturing, Semiconducting wafers, Packaging, Logic, Switches, Neodymium

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