Chilas develops off-the-shelf laser sources based on hybrid integration of Photonic Integrated Chips (PICs). Combining the high optical powers of semiconducting optical amplifiers (SOAs) with low-loss wavelength tunable mirror structures on Si3N4 PICs results in compact and robust tunable laser sources. These extended cavity diode lasers (ECDLs) exhibit unique characteristics like wide tuning ranges (>100 nm), ultra-narrow linewidths (<1 kHz) and high output powers. Here we present up to 162.5 mW of optical output power by combining two SOAs inside a single cavity, thereby scaling the output power without the need of additional optical amplification on the output port. The presented laser operates inside the telecom C-band, but the strategy can be tailored to other wavelengths like 850 nm, 780 nm and 690 nm, where Si3N4 plays a key role. This new generation of hybrid integrated ECDLs, exhibiting high optical output powers, wide wavelength tuning ranges and ultra narrow linewidths, opens up a wide range of applications.
Ultra-narrow linewidth tunable hybrid integrated lasers are built from a combination of indium phosphide (InP) and silicon nitride-based TriPleX™. By combining the active functionality of InP with the ultra-low loss properties of the TriPleX™ platform narrow linewidth lasers in the C-band are realized. The InP platform is used for light generation and the TriPleX™ platform is used to define a long cavity with a wavelength-selective tunable filter. The TriPleX™ platform has the ability to adapt mode profiles over the chip and is extremely suitable for mode matching to the other platforms for hybrid integration. The tunable filter is based on a Vernier of micro-ring resonators to allow for single-mode operation, tunable by thermo-optic or stress-induced tuning. This work will show the operational principle and benefits of the hybrid lasers and the state of the art developments in the realization of these lasers. High optical powers ( <100 mW) are combined with narrow linewidth (< 1 kHz) spectral responses with tunability over a large (>100 nm) wavelength range and a low relative intensity (< -160 dB/Hz).
Photonic Integrated Circuit (PIC) technology is becoming more and more mature and the three main platforms that offer Multi Project Wafer runs (Indium Phosphide (InP), Silicon on Insulator (SOI) and the silicon nitride based TriPleX platform) each have their own unique selling points. New disruptive PIC based modules are enabled by combinations of the different platforms complementing each other in performance. In particular the InP-TriPleX combination are two very complementary technologies. Combining them together yields for instance tunable ultra-narrow linewidth lasers extremely suitable for telecom and sensing applications. Also microwave photonics modules for Optical Beam Forming Networks and 5G communication can, and have been realized with this combination. Important part of this combination is the integration of the different platforms in modules via cost effective assembly techniques. This talk will present the combination of both technologies, the interconnection issues faced in the assembly process and latest measurement results on these hybrid integrated devices.
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