Dr. Kale Beckwitt Profile

Dr. Kale Beckwitt

at Intel Corp

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Proceedings Article | 13 June 2022 Presentation

SEM inspection for logic yield development and control

Timothy Crimmins, Kale Beckwitt

Proceedings Volume PC12053, PC1205305 (2022) https://doi.org/10.1117/12.2619858

KEYWORDS: Logic, Scanning electron microscopy, Inspection, Defect detection, Semiconductor manufacturing, Semiconducting wafers, Optical inspection, Metrology, Control systems

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SEM-based imaging techniques play a strong role in logic semiconductor manufacturing metrology. SEM-based detection techniques have, historically, played a lesser role in inspection, where the objective is defect detection and not imaging. Electron beam inspection (EBI) has seen adoption to monitor systematic defects, with modest area coverage requirements, but it has not been adopted to drive final yield ramp nor for high volume line control due to area coverage challenges at reasonable throughputs. Full logic, yield ramp requires detecting and reducing defect levels from 10^10 per square centimeter levels down to 10^-2. Line control requires measuring enough area to detect excursions from a 10^-2 defects per square centimeter baseline in a factory starting tens of thousands of wafers per month. This first section of this paper reviews the area scaling challenges in detail, stressing the innovation and creativity required to scale SEM as the brute force methods employed by traditional optical inspection systems are not available for EBI. The second section of the paper reviews the design parameter palette available to the EBI developers. The design decisions involving these parameters are mapped to logic yield applications, and the opportunities for future throughput scaling, and more extensive yield ramp and control support, are discussed.

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